Part Details for GS840H18AGB-166 by GSI Technology
Overview of GS840H18AGB-166 by GSI Technology
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (5 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (5 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Price & Stock for GS840H18AGB-166
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
GS840H18AGB-166
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Avnet Americas | SRAM Chip Sync Dual 3.3V 4.5M-Bit 256K x 18 8.5ns/3.5ns 119-Pin F-BGA Bulk - Trays (Alt: GS840H18AGB-166) RoHS: Compliant Min Qty: 84 Package Multiple: 84 Container: Tray | 0 |
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RFQ | |
DISTI #
GS840H18AGB-166
|
Avnet Americas | SRAM Chip Sync Dual 3.3V 4.5M-Bit 256K x 18 8.5ns/3.5ns 119-Pin F-BGA Bulk - Trays (Alt: GS840H18AGB-166) RoHS: Compliant Min Qty: 84 Package Multiple: 84 Container: Tray | 0 |
|
RFQ |
Part Details for GS840H18AGB-166
GS840H18AGB-166 CAD Models
GS840H18AGB-166 Part Data Attributes:
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GS840H18AGB-166
GSI Technology
Buy Now
Datasheet
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Compare Parts:
GS840H18AGB-166
GSI Technology
Cache SRAM, 256KX18, 8.5ns, CMOS, PBGA119, FBGA-119
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | GSI TECHNOLOGY | |
Part Package Code | BGA | |
Package Description | BGA, | |
Pin Count | 119 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.B.2.A | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 8.5 ns | |
Additional Feature | FLOW-THROUGH OR PIPELINED ARCHITECTURE | |
JESD-30 Code | R-PBGA-B119 | |
JESD-609 Code | e1 | |
Length | 22 mm | |
Memory Density | 4718592 bit | |
Memory IC Type | CACHE SRAM | |
Memory Width | 18 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 119 | |
Number of Words | 262144 words | |
Number of Words Code | 256000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 256KX18 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 2.19 mm | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 3 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 14 mm |
Alternate Parts for GS840H18AGB-166
This table gives cross-reference parts and alternative options found for GS840H18AGB-166. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS840H18AGB-166, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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GS840H18AB-166I | Cache SRAM, 256KX18, 8.5ns, CMOS, PBGA119, FBGA-119 | GSI Technology | GS840H18AGB-166 vs GS840H18AB-166I |
GS840H18AGB-166T | Cache SRAM, 256KX18, 8.5ns, CMOS, PBGA119, FBGA-119 | GSI Technology | GS840H18AGB-166 vs GS840H18AGB-166T |
GS840H18AB-166T | Cache SRAM, 256KX18, 8.5ns, CMOS, PBGA119, FBGA-119 | GSI Technology | GS840H18AGB-166 vs GS840H18AB-166T |
GS840H18AGB-166I | Cache SRAM, 256KX18, 8.5ns, CMOS, PBGA119, FBGA-119 | GSI Technology | GS840H18AGB-166 vs GS840H18AGB-166I |
GS840H18AB-166 | Cache SRAM, 256KX18, 8.5ns, CMOS, PBGA119, FBGA-119 | GSI Technology | GS840H18AGB-166 vs GS840H18AB-166 |