Part Details for GS840Z18CGT-166I by GSI Technology
Overview of GS840Z18CGT-166I by GSI Technology
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Price & Stock for GS840Z18CGT-166I
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
GS840Z18CGT-166I
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Avnet Americas | SRAM Chip Sync Dual 2.5V/3.3V 4M-Bit 256K x 18 7ns/3.5ns 100-Pin TQFP - Bulk (Alt: GS840Z18CGT-166I) RoHS: Compliant Min Qty: 72 Package Multiple: 72 Container: Bulk | 0 |
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$5.8853 / $7.2468 | Buy Now |
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DISTI #
464-GS840Z18CGT-166I
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Mouser Electronics | SRAM 2.5 or 3.3V 256K x 18 4M RoHS: Compliant | 0 |
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$6.1200 / $8.5600 | Order Now |
Part Details for GS840Z18CGT-166I
GS840Z18CGT-166I CAD Models
GS840Z18CGT-166I Part Data Attributes
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GS840Z18CGT-166I
GSI Technology
Buy Now
Datasheet
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Compare Parts:
GS840Z18CGT-166I
GSI Technology
ZBT SRAM, 256KX18, 7ns, CMOS, PQFP100, ROHS COMPLIANT, TQFP-100
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | GSI TECHNOLOGY | |
| Part Package Code | QFP | |
| Package Description | LQFP, QFP100,.63X.87 | |
| Pin Count | 100 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.2.B | |
| HTS Code | 8542.32.00.41 | |
| Samacsys Manufacturer | GSI TECHNOLOGY | |
| Access Time-Max | 7 ns | |
| Additional Feature | FLOW-THROUGH OR PIPELINED ARCHITECTURE, ALSO OPERATES AT 3.3V | |
| Clock Frequency-Max (fCLK) | 166 MHz | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PQFP-G100 | |
| Length | 20 mm | |
| Memory Density | 4718592 bit | |
| Memory IC Type | ZBT SRAM | |
| Memory Width | 18 | |
| Number of Functions | 1 | |
| Number of Terminals | 100 | |
| Number of Words | 262144 words | |
| Number of Words Code | 256000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 256KX18 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LQFP | |
| Package Equivalence Code | QFP100,.63X.87 | |
| Package Shape | RECTANGULAR | |
| Package Style | FLATPACK, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.6 mm | |
| Standby Current-Max | 0.045 A | |
| Standby Voltage-Min | 3.14 V | |
| Supply Current-Max | 0.16 mA | |
| Supply Voltage-Max (Vsup) | 2.7 V | |
| Supply Voltage-Min (Vsup) | 2.3 V | |
| Supply Voltage-Nom (Vsup) | 2.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 14 mm |