Part Details for GS8662DT06BD-500 by GSI Technology
Overview of GS8662DT06BD-500 by GSI Technology
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for GS8662DT06BD-500
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
GS8662DT06BD-500
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Avnet Americas | SRAM Chip Sync Dual 1.8V 72M-Bit 8M x 8 0.45ns 165-Pin FBGA - Bulk (Alt: GS8662DT06BD-500) RoHS: Not Compliant Min Qty: 144 Package Multiple: 144 Lead time: 24 Weeks, 0 Days Container: Bulk | 0 |
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$91.8168 / $113.0580 | Buy Now |
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DISTI #
464-GS8662DT06BD-500
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Mouser Electronics | SRAM 1.8 or 1.5V 8M x 8 64M | 0 |
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$102.8300 / $107.4000 | Order Now |
Part Details for GS8662DT06BD-500
GS8662DT06BD-500 CAD Models
GS8662DT06BD-500 Part Data Attributes
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GS8662DT06BD-500
GSI Technology
Buy Now
Datasheet
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Compare Parts:
GS8662DT06BD-500
GSI Technology
QDR SRAM, 8MX8, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165
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| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | GSI TECHNOLOGY | |
| Part Package Code | BGA | |
| Package Description | LBGA, | |
| Pin Count | 165 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.2.B | |
| HTS Code | 8542.32.00.41 | |
| Factory Lead Time | 24 Weeks | |
| Access Time-Max | 0.45 ns | |
| Additional Feature | PIPELINED ARCHITECTURE | |
| JESD-30 Code | R-PBGA-B165 | |
| Length | 15 mm | |
| Memory Density | 67108864 bit | |
| Memory IC Type | QDR SRAM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 165 | |
| Number of Words | 8388608 words | |
| Number of Words Code | 8000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 8MX8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Seated Height-Max | 1.4 mm | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 13 mm |
Alternate Parts for GS8662DT06BD-500
This table gives cross-reference parts and alternative options found for GS8662DT06BD-500. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS8662DT06BD-500, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| CY7C1516AV18-200BZI | DDR SRAM, 8MX8, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | Cypress Semiconductor | GS8662DT06BD-500 vs CY7C1516AV18-200BZI |
| CY7C1522V18-200BZXI | DDR SRAM, 8MX8, 0.45ns, CMOS, PBGA165, 17 X 15 MM, 1.4 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | Cypress Semiconductor | GS8662DT06BD-500 vs CY7C1522V18-200BZXI |
| CY7C1516V18-300BZC | DDR SRAM, 8MX8, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | Cypress Semiconductor | GS8662DT06BD-500 vs CY7C1516V18-300BZC |
| CY7C1511V18-167BZXI | QDR SRAM, 8MX8, 0.5ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | Cypress Semiconductor | GS8662DT06BD-500 vs CY7C1511V18-167BZXI |
| GS8662Q07BGD-300IT | DDR SRAM, 8MX8, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | GS8662DT06BD-500 vs GS8662Q07BGD-300IT |
| GS8662D06BGD-550 | Standard SRAM, 8MX8, 0.29ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | GS8662DT06BD-500 vs GS8662D06BGD-550 |
| GS8662Q08BD-300T | QDR SRAM, 8MX8, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | GS8662DT06BD-500 vs GS8662Q08BD-300T |
| GS8662T07BD-375T | DDR SRAM, 8MX8, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 | GSI Technology | GS8662DT06BD-500 vs GS8662T07BD-375T |
| GS8662T08BGD-200IT | DDR SRAM, 8MX8, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | GS8662DT06BD-500 vs GS8662T08BGD-200IT |
| GS8662D07BGD-375I | DDR SRAM, 8MX8, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | GS8662DT06BD-500 vs GS8662D07BGD-375I |