There are no models available for this part yet.
Overview of GS8662T08BD-300I by GSI Technology
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 2 listings )
- Number of FFF Equivalents: ( 8 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
LT8300IS5#TRPBF | Analog Devices | 100VIN uP Iso Fly Conv w/ 150V | |
LT8300IS5#WTRPBF | Analog Devices | 100VIN uP Iso Fly Conv w/ 150V | |
LTC3300IUK-2#TRPBF | Analog Devices | Addressable Hi Eff Bi-dir Mult |
Price & Stock for GS8662T08BD-300I by GSI Technology
Part # | Manufacturer | Description | Stock | Price | Buy | ||
---|---|---|---|---|---|---|---|
DISTI #
GS8662T08BD-300I
|
Avnet Americas | SRAM Chip Sync Single 1.8V 72M-Bit 8M x 8 0.45ns 165-Pin FBGA Tray - Bulk (Alt: GS8662T08BD-300I) RoHS: Not Compliant Min Qty: 144 Package Multiple: 144 Lead time: 24 Weeks, 0 Days Container: Bulk | 0 |
|
$73.6464 / $90.6840 | Buy Now | |
DISTI #
464-GS8662T08BD-300I
|
Mouser Electronics | SRAM 1.8 or 1.5V 8M x 8 64M | 0 |
|
$82.4800 / $86.1500 | Order Now |
CAD Models for GS8662T08BD-300I by GSI Technology
Part Data Attributes for GS8662T08BD-300I by GSI Technology
|
|
---|---|
Pbfree Code
|
No
|
Rohs Code
|
No
|
Part Life Cycle Code
|
Active
|
Ihs Manufacturer
|
GSI TECHNOLOGY
|
Part Package Code
|
BGA
|
Package Description
|
LBGA, BGA165,11X15,40
|
Pin Count
|
165
|
Reach Compliance Code
|
compliant
|
ECCN Code
|
3A991.B.2.B
|
HTS Code
|
8542.32.00.41
|
Factory Lead Time
|
24 Weeks
|
Access Time-Max
|
0.45 ns
|
Additional Feature
|
PIPELINED ARCHITECTURE, LATE WRITE
|
Clock Frequency-Max (fCLK)
|
300 MHz
|
I/O Type
|
COMMON
|
JESD-30 Code
|
R-PBGA-B165
|
JESD-609 Code
|
e0
|
Length
|
15 mm
|
Memory Density
|
67108864 bit
|
Memory IC Type
|
DDR SRAM
|
Memory Width
|
8
|
Number of Functions
|
1
|
Number of Terminals
|
165
|
Number of Words
|
8388608 words
|
Number of Words Code
|
8000000
|
Operating Mode
|
SYNCHRONOUS
|
Operating Temperature-Max
|
85 °C
|
Operating Temperature-Min
|
-40 °C
|
Organization
|
8MX8
|
Output Characteristics
|
3-STATE
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
LBGA
|
Package Equivalence Code
|
BGA165,11X15,40
|
Package Shape
|
RECTANGULAR
|
Package Style
|
GRID ARRAY, LOW PROFILE
|
Parallel/Serial
|
PARALLEL
|
Qualification Status
|
Not Qualified
|
Seated Height-Max
|
1.4 mm
|
Standby Voltage-Min
|
1.7 V
|
Supply Current-Max
|
0.505 mA
|
Supply Voltage-Max (Vsup)
|
1.9 V
|
Supply Voltage-Min (Vsup)
|
1.7 V
|
Supply Voltage-Nom (Vsup)
|
1.8 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
INDUSTRIAL
|
Terminal Finish
|
TIN LEAD
|
Terminal Form
|
BALL
|
Terminal Pitch
|
1 mm
|
Terminal Position
|
BOTTOM
|
Width
|
13 mm
|
Alternate Parts for GS8662T08BD-300I
This table gives cross-reference parts and alternative options found for GS8662T08BD-300I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS8662T08BD-300I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
CY7C1516AV18-300BZXI | DDR SRAM, 8MX8, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | Cypress Semiconductor | GS8662T08BD-300I vs CY7C1516AV18-300BZXI |
CY7C1516JV18-300BZI | DDR SRAM, 8MX8, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | Cypress Semiconductor | GS8662T08BD-300I vs CY7C1516JV18-300BZI |
CY7C1516AV18-300BZI | DDR SRAM, 8MX8, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | Cypress Semiconductor | GS8662T08BD-300I vs CY7C1516AV18-300BZI |
CY7C1566V18-300BZXI | DDR SRAM, 8MX8, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | Cypress Semiconductor | GS8662T08BD-300I vs CY7C1566V18-300BZXI |
CY7C1566V18-300BZI | DDR SRAM, 8MX8, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | Cypress Semiconductor | GS8662T08BD-300I vs CY7C1566V18-300BZI |
GS8662T08BGD-300I | DDR SRAM, 8MX8, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 | GSI Technology | GS8662T08BD-300I vs GS8662T08BGD-300I |
CY7C1516V18-300BZXI | DDR SRAM, 8MX8, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | Cypress Semiconductor | GS8662T08BD-300I vs CY7C1516V18-300BZXI |
CY7C1516JV18-300BZXI | DDR SRAM, 8MX8, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | Cypress Semiconductor | GS8662T08BD-300I vs CY7C1516JV18-300BZXI |