Datasheets
GS8662T09BGD-400I by: GSI Technology

DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165

Part Details for GS8662T09BGD-400I by GSI Technology

Overview of GS8662T09BGD-400I by GSI Technology

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Price & Stock for GS8662T09BGD-400I

Part # Distributor Description Stock Price Buy
DISTI # GS8662T09BGD-400I
Avnet Americas SRAM Chip Sync Single 1.8V 72M-Bit 8M x 9-Bit 0.45ns 165-Pin FBGA Tray - Bulk (Alt: GS8662T09BGD-400I) RoHS: Compliant Min Qty: 144 Package Multiple: 144 Lead time: 24 Weeks, 0 Days Container: Bulk 0
  • 144 $170.7750
  • 288 $167.6700
  • 576 $159.3900
  • 864 $155.2500
  • 1,152 $150.0750
  • 1,440 $142.8300
  • 14,400 $138.6900
$138.6900 / $170.7750 Buy Now
DISTI # 464-GS8662T09BGD400I
Mouser Electronics SRAM 1.8 or 1.5V 8M x 9 72M RoHS: Compliant 0
  • 15 $155.6400
  • 30 $155.2100
$155.2100 / $155.6400 Order Now
DISTI # GS8662T09BGD-400I
Avnet Americas SRAM Chip Sync Single 1.8V 72M-Bit 8M x 9-Bit 0.45ns 165-Pin FBGA Tray - Bulk (Alt: GS8662T09BGD-400I) RoHS: Compliant Min Qty: 144 Package Multiple: 144 Lead time: 24 Weeks, 0 Days Container: Bulk 0
  • 144 $170.7750
  • 288 $167.6700
  • 576 $159.3900
  • 864 $155.2500
  • 1,152 $150.0750
  • 1,440 $142.8300
  • 14,400 $138.6900
$138.6900 / $170.7750 Buy Now

Part Details for GS8662T09BGD-400I

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GS8662T09BGD-400I Part Data Attributes:

GS8662T09BGD-400I GSI Technology
Buy Now Datasheet
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GS8662T09BGD-400I GSI Technology DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer GSI TECHNOLOGY
Part Package Code BGA
Package Description LBGA, BGA165,11X15,40
Pin Count 165
Reach Compliance Code compliant
ECCN Code 3A991.B.2.B
HTS Code 8542.32.00.41
Factory Lead Time 24 Weeks
Access Time-Max 0.45 ns
Additional Feature PIPELINED ARCHITECTURE, LATE WRITE
Clock Frequency-Max (fCLK) 400 MHz
I/O Type COMMON
JESD-30 Code R-PBGA-B165
Length 15 mm
Memory Density 75497472 bit
Memory IC Type DDR SRAM
Memory Width 9
Number of Functions 1
Number of Terminals 165
Number of Words 8388608 words
Number of Words Code 8000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 8MX9
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA165,11X15,40
Package Shape RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Seated Height-Max 1.4 mm
Standby Current-Max 0.255 A
Standby Voltage-Min 1.7 V
Supply Current-Max 0.635 mA
Supply Voltage-Max (Vsup) 1.9 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 13 mm

Alternate Parts for GS8662T09BGD-400I

This table gives cross-reference parts and alternative options found for GS8662T09BGD-400I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS8662T09BGD-400I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
GS8662T09BD-400IT DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, BGA-165 GSI Technology GS8662T09BGD-400I vs GS8662T09BD-400IT
GS8662T09BD-400I DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, BGA-165 GSI Technology GS8662T09BGD-400I vs GS8662T09BD-400I
GS8662T09BGD-400IT DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8662T09BGD-400I vs GS8662T09BGD-400IT
Part Number Description Manufacturer Compare
GS8662D09BGD-200T Standard SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8662T09BGD-400I vs GS8662D09BGD-200T
GS8662D09BD-300T QDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8662T09BGD-400I vs GS8662D09BD-300T
CY7C1528V18-200BZXC DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 Cypress Semiconductor GS8662T09BGD-400I vs CY7C1528V18-200BZXC
GS8662R09BGD-250 Standard SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8662T09BGD-400I vs GS8662R09BGD-250
GS8662Q09BGD-357T QDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8662T09BGD-400I vs GS8662Q09BGD-357T
GS8662D10BD-400IT DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8662T09BGD-400I vs GS8662D10BD-400IT
GS8662TT10BGD-450T DDR SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8662T09BGD-400I vs GS8662TT10BGD-450T
GS8662R09BD-167T Standard SRAM, 8MX9, 0.5ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, FPBGA-165 GSI Technology GS8662T09BGD-400I vs GS8662R09BD-167T
GS8662R09BGD-250T Standard SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8662T09BGD-400I vs GS8662R09BGD-250T
GS8662Q09GE-300I Standard SRAM, 8MX9, 0.45ns, CMOS, PBGA165, 15 X17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology GS8662T09BGD-400I vs GS8662Q09GE-300I

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