Part Details for GS88218CB-300M by GSI Technology
Overview of GS88218CB-300M by GSI Technology
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| SF-10GSFPPLCL-000 | Amphenol Cables on Demand | Amphenol SF-10GSFPPLCL-000 SFP+ Optical Module - 10GBASE-SR (up to 300m/984') SFP+ Multimode Optical Transceiver Module (Duplex LC Connectors) - Cisco & HP Compatible | |
| QXP85A4-02D-2 | Amphenol Communications Solutions | 40G QSFP+ SR4 300m OM3 400m OM4 | |
| LT8300MPS5#TRMPBF | Analog Devices | 100VIN uP Iso Fly Conv w/ 150V |
Price & Stock for GS88218CB-300M
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
GS88218CB-300M
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Avnet Americas | SRAM Chip Sync Dual 2.5V/3.3V 9M-Bit 512K x 18 5ns/2.5ns 119-Pin F-BGA - Bulk (Alt: GS88218CB-300M) RoHS: Not Compliant Min Qty: 84 Package Multiple: 84 Lead time: 24 Weeks, 0 Days Container: Bulk | 0 |
|
$59.5764 / $73.3590 | Buy Now |
|
DISTI #
464-GS88218CB-300M
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Mouser Electronics | SRAM 2.5 or 3.3V 512K x 18 9M | 0 |
|
$58.4100 / $66.7200 | Order Now |
Part Details for GS88218CB-300M
GS88218CB-300M CAD Models
GS88218CB-300M Part Data Attributes
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GS88218CB-300M
GSI Technology
Buy Now
Datasheet
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Compare Parts:
GS88218CB-300M
GSI Technology
Cache SRAM, 512KX18, 5ns, CMOS, PBGA119, FPBGA-119
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| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | GSI TECHNOLOGY | |
| Part Package Code | BGA | |
| Package Description | BGA, | |
| Pin Count | 119 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.2.B | |
| HTS Code | 8542.32.00.41 | |
| Factory Lead Time | 24 Weeks | |
| Access Time-Max | 5 ns | |
| Additional Feature | FLOW-THROUGH OR PIPELINED ARCHITECTURE, IT CAN ALSO OPERATES AT AS 3.3 V SUPPLY | |
| JESD-30 Code | R-PBGA-B119 | |
| Length | 22 mm | |
| Memory Density | 9437184 bit | |
| Memory IC Type | CACHE SRAM | |
| Memory Width | 18 | |
| Number of Functions | 1 | |
| Number of Terminals | 119 | |
| Number of Words | 524288 words | |
| Number of Words Code | 512000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 512KX18 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.99 mm | |
| Supply Voltage-Max (Vsup) | 2.7 V | |
| Supply Voltage-Min (Vsup) | 2.3 V | |
| Supply Voltage-Nom (Vsup) | 2.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 14 mm |
Alternate Parts for GS88218CB-300M
This table gives cross-reference parts and alternative options found for GS88218CB-300M. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of GS88218CB-300M, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| CY7C1355V25-117BAC | ZBT SRAM, 256KX36, 7.5ns, CMOS, PBGA119, BGA-119 | Cypress Semiconductor | GS88218CB-300M vs CY7C1355V25-117BAC |
| IS61SPS51218D-133B | Cache SRAM, 512KX18, 4ns, CMOS, PBGA119, PLASTIC, BGA-119 | Integrated Silicon Solution Inc | GS88218CB-300M vs IS61SPS51218D-133B |
| UPD4481322F9-C50-EQX | ZBT SRAM, 256KX32, 3.2ns, CMOS, PBGA165, 13 X 15 MM, FBGA-165 | NEC Electronics Group | GS88218CB-300M vs UPD4481322F9-C50-EQX |
| IDT71V659S80BG | ZBT SRAM, 512KX18, 8ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, BGA-119 | Integrated Device Technology Inc | GS88218CB-300M vs IDT71V659S80BG |
| IDT71T658S133BG | ZBT SRAM, 512KX18, 4.2ns, CMOS, PBGA119, 14 X 22 MM, PLASTIC, BGA-119 | Integrated Device Technology Inc | GS88218CB-300M vs IDT71T658S133BG |
| IBM0418A81NLAB-4 | Standard SRAM, 512KX18, 2.25ns, CMOS, PBGA119, BGA-119 | IBM | GS88218CB-300M vs IBM0418A81NLAB-4 |
| UPD4382182GF-A67B | Cache SRAM, 512KX18, 3.8ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, LQFP-100 | NEC Electronics Group | GS88218CB-300M vs UPD4382182GF-A67B |
| UPD4381322GF-A75 | ZBT SRAM, 256KX32, 4.2ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, LQFP-100 | NEC Electronics Group | GS88218CB-300M vs UPD4381322GF-A75 |
| IDT71T657S80PF | ZBT SRAM, 256KX36, 8ns, CMOS, PQFP100, 14 X 20 MM, PLASTIC, TQFP-100 | Integrated Device Technology Inc | GS88218CB-300M vs IDT71T657S80PF |
| CY7C1360B-225AC | Cache SRAM, 256KX36, 2.8ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 | Cypress Semiconductor | GS88218CB-300M vs CY7C1360B-225AC |