Part Details for HD6301V1CG by Renesas Electronics Corporation
Overview of HD6301V1CG by Renesas Electronics Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part Details for HD6301V1CG
HD6301V1CG CAD Models
HD6301V1CG Part Data Attributes
|
HD6301V1CG
Renesas Electronics Corporation
Buy Now
Datasheet
|
Compare Parts:
HD6301V1CG
Renesas Electronics Corporation
8-BIT, MROM, 1MHz, MICROCONTROLLER, CQCC40, GLASS SEALED, CERAMIC, LCC-40
|
Part Life Cycle Code | Contact Manufacturer | |
Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
Part Package Code | LCC | |
Package Description | HVQCCN, | |
Pin Count | 40 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.31.00.01 | |
Has ADC | NO | |
Address Bus Width | 16 | |
Bit Size | 8 | |
Clock Frequency-Max | 4 MHz | |
DAC Channels | NO | |
DMA Channels | NO | |
External Data Bus Width | 8 | |
JESD-30 Code | S-GQCC-N40 | |
Length | 12.19 mm | |
Number of I/O Lines | 29 | |
Number of Terminals | 40 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
PWM Channels | NO | |
Package Body Material | CERAMIC, GLASS-SEALED | |
Package Code | HVQCCN | |
Package Shape | SQUARE | |
Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
Qualification Status | Not Qualified | |
ROM Programmability | MROM | |
Seated Height-Max | 2.35 mm | |
Speed | 1 MHz | |
Supply Voltage-Max | 5.5 V | |
Supply Voltage-Min | 4.5 V | |
Supply Voltage-Nom | 5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Form | NO LEAD | |
Terminal Pitch | 1.02 mm | |
Terminal Position | QUAD | |
Width | 12.19 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |