Part Details for HSDL-3602-007 by Lite-On Semiconductor Corporation
Overview of HSDL-3602-007 by Lite-On Semiconductor Corporation
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (3 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (3 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Space Technology
Aerospace and Defense
Transportation and Logistics
Renewable Energy
Automotive
Robotics and Drones
Price & Stock for HSDL-3602-007
| Part # | Distributor | Description | Stock | Price | Buy | |
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Chip 1 Exchange | INSTOCK | 151 |
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RFQ | |
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Chip1Cloud | IRDA MODULE 4MBPS 10-SMD | 3130 |
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RFQ |
Part Details for HSDL-3602-007
HSDL-3602-007 CAD Models
HSDL-3602-007 Part Data Attributes:
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HSDL-3602-007
Lite-On Semiconductor Corporation
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Datasheet
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Compare Parts:
HSDL-3602-007
Lite-On Semiconductor Corporation
Interface Circuit, BICMOS, 12.2 X 4.9 MM, 4 MM HEIGHT, MODULE-10
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | LITE-ON TECHNOLOGY CORP | |
| Part Package Code | MODULE | |
| Package Description | 12.2 X 4.9 MM, 4 MM HEIGHT, MODULE-10 | |
| Pin Count | 10 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| Interface IC Type | INTERFACE CIRCUIT | |
| JESD-30 Code | R-XSMA-N10 | |
| JESD-609 Code | e3 | |
| Number of Functions | 1 | |
| Number of Terminals | 10 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | -20 °C | |
| Package Body Material | UNSPECIFIED | |
| Package Shape | RECTANGULAR | |
| Package Style | MICROELECTRONIC ASSEMBLY | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 2.7 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | NO | |
| Technology | BICMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | Tin (Sn) | |
| Terminal Form | NO LEAD | |
| Terminal Position | SINGLE | |
| Time@Peak Reflow Temperature-Max (s) | 10 |
Alternate Parts for HSDL-3602-007
This table gives cross-reference parts and alternative options found for HSDL-3602-007. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HSDL-3602-007, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| HSDL-3602-007 | SPECIALTY INTERFACE CIRCUIT, SMA10, 12.2 X 4.9 MM, 4 MM HEIGHT, MODULE-10 | Avago Technologies | HSDL-3602-007 vs HSDL-3602-007 |
| HSDL-3602-007 | Interface Circuit, BICMOS, 12.2 X 4.9 MM, 4 MM HEIGHT, MODULE-10 | Agilent Technologies Inc | HSDL-3602-007 vs HSDL-3602-007 |
| HSDL-3602-037 | Interface Circuit, BICMOS, 12.2 X 4.9 MM, 4 MM HEIGHT, MODULE-10 | Agilent Technologies Inc | HSDL-3602-007 vs HSDL-3602-037 |