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Parametric » Drivers And Interfaces » Other Interface ICs

Parametric results for: HSDL-3602-007 under Other Interface ICs

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Select Parts		Part Number

		HSDL-3602-007 Lite-On Semiconductor Corporation
		HSDL-3602-007 Broadcom Limited
		HSDL-3602-007 Agilent Technologies Inc
		HSDL-3602-007 Avago Technologies

				Most Relevant	Technical							Compliance			Operating Conditions					Physical							Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom	Interface IC Type	Technology	Number of Functions	Supply Voltage-Max	Supply Voltage-Min	Surface Mount	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Position	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	HTS Code	Samacsys Manufacturer

Check for Price

Yes

Obsolete

3.3 V

INTERFACE CIRCUIT

BICMOS

1

3.6 V

2.7 V

NO

COMMERCIAL

R-XSMA-N10

Not Qualified

e3

70 °C

-20 °C

260

10

10

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

Tin (Sn)

NO LEAD

SINGLE

LITE-ON TECHNOLOGY CORP

MODULE

12.2 X 4.9 MM, 4 MM HEIGHT, MODULE-10

10

unknown

8542.39.00.01

Check for Price

Yes

Transferred

3.3 V

INTERFACE CIRCUIT

BICMOS

1

3.6 V

2.7 V

NO

COMMERCIAL

R-XSMA-N10

Not Qualified

4

70 °C

-20 °C

255

10

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

NO LEAD

SINGLE

BROADCOM LTD

,

compliant

8542.39.00.01

Avago Technologies

Check for Price

No

Transferred

3.3 V

INTERFACE CIRCUIT

BICMOS

1

3.6 V

2.7 V

NO

COMMERCIAL

R-XSMA-N10

Not Qualified

e0

70 °C

-20 °C

10

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

TIN LEAD

NO LEAD

SINGLE

AGILENT TECHNOLOGIES INC

MODULE

,

10

unknown

8542.39.00.01

Check for Price

Yes

Yes

Transferred

3.3 V

INTERFACE CIRCUIT

BICMOS

1

3.6 V

2.7 V

NO

COMMERCIAL

R-XSMA-N10

Not Qualified

4

70 °C

-20 °C

255

10

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

NO LEAD

SINGLE

AVAGO TECHNOLOGIES INC

MODULE

,

10

compliant

8542.39.00.01

Avago Technologies

Compare

Drivers And Interfaces

Lite-On Semiconductor Corporation

Check for Price

Yes

Obsolete

3.3 V

INTERFACE CIRCUIT

BICMOS

1

3.6 V

2.7 V

NO

COMMERCIAL

R-XSMA-N10

Not Qualified

e3

70 °C

-20 °C

260

10

10

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

Tin (Sn)

NO LEAD

SINGLE

LITE-ON TECHNOLOGY CORP

MODULE

12.2 X 4.9 MM, 4 MM HEIGHT, MODULE-10

10

unknown

8542.39.00.01

Broadcom Limited

Check for Price

Yes

Transferred

3.3 V

INTERFACE CIRCUIT

BICMOS

1

3.6 V

2.7 V

NO

COMMERCIAL

R-XSMA-N10

Not Qualified

4

70 °C

-20 °C

255

10

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

NO LEAD

SINGLE

BROADCOM LTD

,

compliant

8542.39.00.01

Avago Technologies

Drivers And Interfaces

Agilent Technologies Inc

Check for Price

No

Transferred

3.3 V

INTERFACE CIRCUIT

BICMOS

1

3.6 V

2.7 V

NO

COMMERCIAL

R-XSMA-N10

Not Qualified

e0

70 °C

-20 °C

10

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

TIN LEAD

NO LEAD

SINGLE

AGILENT TECHNOLOGIES INC

MODULE

,

10

unknown

8542.39.00.01

Drivers And Interfaces

Avago Technologies

Check for Price

Yes

Yes

Transferred

3.3 V

INTERFACE CIRCUIT

BICMOS

1

3.6 V

2.7 V

NO

COMMERCIAL

R-XSMA-N10

Not Qualified

4

70 °C

-20 °C

255

10

UNSPECIFIED

RECTANGULAR

MICROELECTRONIC ASSEMBLY

NO LEAD

SINGLE

AVAGO TECHNOLOGIES INC

MODULE

,

10

compliant

8542.39.00.01

Avago Technologies