Part Details for IPC302NE7N3X1SA1 by Infineon Technologies AG
Overview of IPC302NE7N3X1SA1 by Infineon Technologies AG
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- Part Data Attributes
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Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Smart Cities
Electronic Manufacturing
Price & Stock for IPC302NE7N3X1SA1
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
448-IPC302NE7N3X1SA1-ND
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DigiKey | MOSFET N-CH 75V 1A SAWN ON FOIL Min Qty: 4425 Lead time: 28 Weeks Container: Bulk | Limited Supply - Call |
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$2.9124 | Buy Now |
DISTI #
IPC302NE7N3X1SA1
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Avnet Americas | Trans MOSFET N-CH 75V DIE Wafer - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: IPC302NE7N3X1SA1) RoHS: Compliant Min Qty: 4425 Package Multiple: 1 Lead time: 28 Weeks, 0 Days Container: Waffle Pack | 0 |
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$3.1294 / $3.5765 | Buy Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 4425 Package Multiple: 1 | 0 |
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$3.1500 | Buy Now |
DISTI #
IPC302NE7N3X1SA1
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Avnet Americas | Trans MOSFET N-CH 75V DIE Wafer - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: IPC302NE7N3X1SA1) RoHS: Compliant Min Qty: 4425 Package Multiple: 1 Lead time: 28 Weeks, 0 Days Container: Waffle Pack | 0 |
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$3.1294 / $3.5765 | Buy Now |
DISTI #
IPC302NE7N3X1SA1
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Avnet Americas | Trans MOSFET N-CH 75V DIE Wafer - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: IPC302NE7N3X1SA1) RoHS: Compliant Min Qty: 4425 Package Multiple: 1 Lead time: 28 Weeks, 0 Days Container: Waffle Pack | 0 |
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$3.1294 / $3.5765 | Buy Now |
DISTI #
SP000840426
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EBV Elektronik | Trans MOSFET N-CH 75V DIE Wafer (Alt: SP000840426) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 4 Weeks, 1 Days | EBV - 0 |
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Buy Now |
Part Details for IPC302NE7N3X1SA1
IPC302NE7N3X1SA1 CAD Models
IPC302NE7N3X1SA1 Part Data Attributes
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IPC302NE7N3X1SA1
Infineon Technologies AG
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Datasheet
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Compare Parts:
IPC302NE7N3X1SA1
Infineon Technologies AG
Small Signal Field-Effect Transistor, 75V, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, DIE
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Rohs Code | Yes | |
Part Life Cycle Code | Not Recommended | |
Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
Package Description | UNCASED CHIP, R-XXUC-N | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
Factory Lead Time | 28 Weeks | |
Configuration | SINGLE WITH BUILT-IN DIODE | |
DS Breakdown Voltage-Min | 75 V | |
Drain-source On Resistance-Max | 0.1 Ω | |
FET Technology | METAL-OXIDE SEMICONDUCTOR | |
JESD-30 Code | R-XXUC-N | |
Number of Elements | 1 | |
Operating Mode | ENHANCEMENT MODE | |
Package Body Material | UNSPECIFIED | |
Package Shape | RECTANGULAR | |
Package Style | UNCASED CHIP | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Polarity/Channel Type | N-CHANNEL | |
Surface Mount | YES | |
Terminal Form | NO LEAD | |
Terminal Position | UNSPECIFIED | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Transistor Element Material | SILICON |