There are no models available for this part yet.
Overview of IS61DDPB22M18A-400M3L by Integrated Silicon Solution Inc
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 3 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Computing and Data Storage
Price & Stock for IS61DDPB22M18A-400M3L by Integrated Silicon Solution Inc
| Part # | Manufacturer | Description | Stock | Price | Buy | ||
|---|---|---|---|---|---|---|---|
|
DISTI #
77T0700
|
Newark | 36Mb, Ddr Iip (Burst Of 2) Cio, Sync Sram, 2M X 18, 2.5 Read Latency, 165 Ball Fbga (15X17 Mm), Rohs |Integrated Silicon Solution (Issi) IS61DDPB22M18A-400M3L RoHS: Not Compliant Min Qty: 105 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
|
$64.0000 | Buy Now | |
|
DISTI #
IS61DDPB22M18A-400
|
Avnet Americas | SRAM Chip Sync Single 1.8V 36M-Bit 2M x 18 0.45ns 165-Pin LFBGA - Bulk (Alt: IS61DDPB22M18A-400) RoHS: Not Compliant Min Qty: 105 Package Multiple: 105 Lead time: 30 Weeks, 0 Days Container: Bulk | 0 |
|
RFQ | ||
|
DISTI #
870-61DB22M18A400M3L
|
Mouser Electronics | SRAM 36Mb, DDR IIP (Burst of 2) CIO, Sync SRAM, 2M x 18, 2.5 Read Latency, 165 Ball FBGA (15x17 mm), RoHS RoHS: Compliant | 0 |
|
$65.6900 | Order Now |
CAD Models for IS61DDPB22M18A-400M3L by Integrated Silicon Solution Inc
Part Data Attributes for IS61DDPB22M18A-400M3L by Integrated Silicon Solution Inc
|
|
|
|---|---|
|
Pbfree Code
|
Yes
|
|
Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
Active
|
|
Ihs Manufacturer
|
INTEGRATED SILICON SOLUTION INC
|
|
Part Package Code
|
BGA
|
|
Package Description
|
LBGA, BGA165,11X15,40
|
|
Pin Count
|
165
|
|
Reach Compliance Code
|
compliant
|
|
ECCN Code
|
3A991.B.2.A
|
|
HTS Code
|
8542.32.00.41
|
|
Factory Lead Time
|
30 Weeks
|
|
Access Time-Max
|
0.45 ns
|
|
Additional Feature
|
PIPELINED ARCHITECTURE
|
|
Clock Frequency-Max (fCLK)
|
400 MHz
|
|
I/O Type
|
COMMON
|
|
JESD-30 Code
|
R-PBGA-B165
|
|
JESD-609 Code
|
e1
|
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Length
|
17 mm
|
|
Memory Density
|
37748736 bit
|
|
Memory IC Type
|
DDR SRAM
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|
Memory Width
|
18
|
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Moisture Sensitivity Level
|
3
|
|
Number of Functions
|
1
|
|
Number of Terminals
|
165
|
|
Number of Words
|
2097152 words
|
|
Number of Words Code
|
2000000
|
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Operating Mode
|
SYNCHRONOUS
|
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Operating Temperature-Max
|
70 °C
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Operating Temperature-Min
|
|
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Organization
|
2MX18
|
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Output Characteristics
|
3-STATE
|
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Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
LBGA
|
|
Package Equivalence Code
|
BGA165,11X15,40
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
GRID ARRAY, LOW PROFILE
|
|
Parallel/Serial
|
PARALLEL
|
|
Qualification Status
|
Not Qualified
|
|
Seated Height-Max
|
1.4 mm
|
|
Standby Current-Max
|
0.32 A
|
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Standby Voltage-Min
|
1.7 V
|
|
Supply Current-Max
|
0.75 mA
|
|
Supply Voltage-Max (Vsup)
|
1.89 V
|
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Supply Voltage-Min (Vsup)
|
1.71 V
|
|
Supply Voltage-Nom (Vsup)
|
1.8 V
|
|
Surface Mount
|
YES
|
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Technology
|
CMOS
|
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Temperature Grade
|
COMMERCIAL
|
|
Terminal Finish
|
Tin/Silver/Copper (Sn/Ag/Cu)
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|
Terminal Form
|
BALL
|
|
Terminal Pitch
|
1 mm
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Terminal Position
|
BOTTOM
|
|
Width
|
15 mm
|