Part Details for IS61LPS12836EC-200B3LI by Integrated Silicon Solution Inc
Overview of IS61LPS12836EC-200B3LI by Integrated Silicon Solution Inc
- Distributor Offerings: (6 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (3 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for IS61LPS12836EC-200B3LI
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
81Y1457
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Newark | 4Mb, pipeline, sync With Ecc,128K X 36,200Mhz,3.3V I/O,165 Ball Bga, Rohs |Integrated Silicon Solution (Issi) IS61LPS12836EC-200B3LI Min Qty: 144 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$6.6700 / $8.2400 | Buy Now |
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DISTI #
IS61LPS12836EC-200B3LI-ND
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DigiKey | IC SRAM 4.5MBIT PAR 165TFBGA Min Qty: 144 Lead time: 10 Weeks Container: Tray | Temporarily Out of Stock |
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$7.4984 | Buy Now |
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DISTI #
IS61LPS12836EC-200
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Avnet Americas | SRAM Chip Sync Quad 3.3V 4M-Bit 128K x 36 3.1ns 165-Pin TFBGA - Trays (Alt: IS61LPS12836EC-200) RoHS: Not Compliant Min Qty: 144 Package Multiple: 144 Lead time: 12 Weeks, 0 Days Container: Tray | 0 |
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$6.1250 / $7.4970 | Buy Now |
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DISTI #
870-61LPS128EC2B3LI
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Mouser Electronics | SRAM 4Mb,Pipeline,Sync with ECC,128K x 36,200Mhz,3.3v I/O,165 Ball BGA, RoHS RoHS: Compliant | 0 |
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$7.0900 / $9.5500 | Order Now |
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DISTI #
IS61LPS12836EC-200
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Avnet Americas | SRAM Chip Sync Quad 3.3V 4M-Bit 128K x 36 3.1ns 165-Pin TFBGA - Trays (Alt: IS61LPS12836EC-200) RoHS: Not Compliant Min Qty: 144 Package Multiple: 144 Lead time: 12 Weeks, 0 Days Container: Tray | 0 |
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$6.1250 / $7.4970 | Buy Now |
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DISTI #
IS61LPS12836EC-200B3LI
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Avnet Silica | SRAM Chip Sync Quad 3.3V 4M-Bit 128K x 36 3.1ns 165-Pin TFBGA (Alt: IS61LPS12836EC-200B3LI) RoHS: Compliant Min Qty: 144 Package Multiple: 144 Lead time: 2 Weeks, 0 Days | Silica - 0 |
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Buy Now |
Part Details for IS61LPS12836EC-200B3LI
IS61LPS12836EC-200B3LI CAD Models
IS61LPS12836EC-200B3LI Part Data Attributes:
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IS61LPS12836EC-200B3LI
Integrated Silicon Solution Inc
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Datasheet
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Compare Parts:
IS61LPS12836EC-200B3LI
Integrated Silicon Solution Inc
Cache SRAM, 128KX36, 3.1ns, CMOS, PBGA165, TFBGA-165
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
| Part Package Code | BGA | |
| Package Description | TBGA, BGA165,11X15,40 | |
| Pin Count | 165 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Factory Lead Time | 12 Weeks | |
| Samacsys Manufacturer | Integrated Silicon Solution Inc. | |
| Access Time-Max | 3.1 ns | |
| Clock Frequency-Max (fCLK) | 200 MHz | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PBGA-B165 | |
| JESD-609 Code | e1 | |
| Length | 15 mm | |
| Memory Density | 4718592 bit | |
| Memory IC Type | CACHE SRAM | |
| Memory Width | 36 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 165 | |
| Number of Words | 131072 words | |
| Number of Words Code | 128000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 128KX36 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TBGA | |
| Package Equivalence Code | BGA165,11X15,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.2 mm | |
| Standby Current-Max | 0.085 A | |
| Standby Voltage-Min | 3.14 V | |
| Supply Current-Max | 0.22 mA | |
| Supply Voltage-Max (Vsup) | 3.465 V | |
| Supply Voltage-Min (Vsup) | 3.135 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 10 | |
| Width | 13 mm |
Alternate Parts for IS61LPS12836EC-200B3LI
This table gives cross-reference parts and alternative options found for IS61LPS12836EC-200B3LI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of IS61LPS12836EC-200B3LI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| IS61LPS12836EC-200B2LI | Cache SRAM, 128KX36, 3.1ns, CMOS, PBGA119, BGA-119 | Integrated Silicon Solution Inc | IS61LPS12836EC-200B3LI vs IS61LPS12836EC-200B2LI |
| IS61LPS12836EC-200B3I | Cache SRAM, 128KX36, 3.1ns, CMOS, PBGA165, TFBGA-165 | Integrated Silicon Solution Inc | IS61LPS12836EC-200B3LI vs IS61LPS12836EC-200B3I |
| IS61LPS12836EC-200TQLI | Cache SRAM, 128KX36, 3.1ns, CMOS, PQFP100, TQFP-100 | Integrated Silicon Solution Inc | IS61LPS12836EC-200B3LI vs IS61LPS12836EC-200TQLI |