Datasheets
IS61NLP25618A-200B3LI by: Integrated Silicon Solution Inc

ZBT SRAM, 256KX18, 3.1ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-165

Part Details for IS61NLP25618A-200B3LI by Integrated Silicon Solution Inc

Overview of IS61NLP25618A-200B3LI by Integrated Silicon Solution Inc

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Price & Stock for IS61NLP25618A-200B3LI

Part # Distributor Description Stock Price Buy
DISTI # IS61NLP25618A-200B3LI-ND
DigiKey IC SRAM 4.5MBIT PARALLEL 165PBGA Min Qty: 144 Lead time: 10 Weeks Container: Tray Temporarily Out of Stock
  • 144 $9.3347
$9.3347 Buy Now
DISTI # IS61NLP25618A-200B
Avnet Americas SRAM Chip Sync Dual 3.3V 4M-Bit 256K x 18 3.1ns 165-Pin PBGA - Bulk (Alt: IS61NLP25618A-200B) RoHS: Not Compliant Min Qty: 144 Package Multiple: 144 Lead time: 12 Weeks, 0 Days Container: Bulk 0
  • 144 $9.3330
  • 288 $9.0890
  • 576 $8.6620
  • 864 $8.4180
  • 1,152 $8.1130
  • 1,440 $7.8690
  • 14,400 $7.6250
$7.6250 / $9.3330 Buy Now
DISTI # 870-61NLP25618A2B3LI
Mouser Electronics SRAM 4Mb,"No-Wait"/Pipeline,Sync,256K x 18,200Mhz,3.3v I/O,165 Ball BGA, RoHS RoHS: Compliant 0
  • 144 $9.0700
  • 288 $8.8100
  • 576 $8.7600
$8.7600 / $9.0700 Order Now

Part Details for IS61NLP25618A-200B3LI

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IS61NLP25618A-200B3LI Part Data Attributes

IS61NLP25618A-200B3LI Integrated Silicon Solution Inc
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IS61NLP25618A-200B3LI Integrated Silicon Solution Inc ZBT SRAM, 256KX18, 3.1ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-165
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC
Part Package Code BGA
Package Description TBGA, BGA165,11X15,40
Pin Count 165
Reach Compliance Code compliant
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Factory Lead Time 12 Weeks
Access Time-Max 3.1 ns
Additional Feature PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 200 MHz
I/O Type COMMON
JESD-30 Code R-PBGA-B165
JESD-609 Code e1
Length 15 mm
Memory Density 4718592 bit
Memory IC Type ZBT SRAM
Memory Width 18
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 165
Number of Words 262144 words
Number of Words Code 256000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 256KX18
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code TBGA
Package Equivalence Code BGA165,11X15,40
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 1.2 mm
Standby Current-Max 0.035 A
Standby Voltage-Min 3.14 V
Supply Current-Max 0.21 mA
Supply Voltage-Max (Vsup) 3.465 V
Supply Voltage-Min (Vsup) 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 10
Width 13 mm

Alternate Parts for IS61NLP25618A-200B3LI

This table gives cross-reference parts and alternative options found for IS61NLP25618A-200B3LI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of IS61NLP25618A-200B3LI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
IDT71V3558S133BQGI ZBT SRAM, 256KX18, 4.2ns, CMOS, PBGA165, 13 X 15 MM, ROHS COMPLIANT, FBGA-165 Integrated Device Technology Inc IS61NLP25618A-200B3LI vs IDT71V3558S133BQGI
IDT71V3579YSA80BQGI Cache SRAM, 256KX18, 8ns, CMOS, PBGA165, FBGA-165 Integrated Device Technology Inc IS61NLP25618A-200B3LI vs IDT71V3579YSA80BQGI
IDT71V3558S166BQGI ZBT SRAM, 256KX18, 3.5ns, CMOS, PBGA165, 13 X 15 MM, ROHS COMPLIANT, FBGA-165 Integrated Device Technology Inc IS61NLP25618A-200B3LI vs IDT71V3558S166BQGI
IDT71V25781YS200BQ Cache SRAM, 256KX18, 3.1ns, CMOS, PBGA165, FBGA-165 Integrated Device Technology Inc IS61NLP25618A-200B3LI vs IDT71V25781YS200BQ
MT58L256V18F1F-6.8 Cache SRAM, 256KX18, 6.8ns, CMOS, PBGA165, FBGA-165 Cypress Semiconductor IS61NLP25618A-200B3LI vs MT58L256V18F1F-6.8
71V2558S200BQG ZBT SRAM, 256KX18, 3.2ns, CMOS, PBGA165, 15 X 13 MM, ROHS COMPLIANT, FBGA-165 Integrated Device Technology Inc IS61NLP25618A-200B3LI vs 71V2558S200BQG
IDT71V35781YS166BQ Cache SRAM, 256KX18, 3.5ns, CMOS, PBGA165, FBGA-165 Integrated Device Technology Inc IS61NLP25618A-200B3LI vs IDT71V35781YS166BQ
71V3558S133BQG ZBT SRAM, 256KX18, 4.2ns, CMOS, PBGA165, 13 X 15 MM, ROHS COMPLIANT, FBGA-165 Integrated Device Technology Inc IS61NLP25618A-200B3LI vs 71V3558S133BQG
IDT71V3579YSA65BQG Cache SRAM, 256KX18, 6.5ns, CMOS, PBGA165, FBGA-165 Integrated Device Technology Inc IS61NLP25618A-200B3LI vs IDT71V3579YSA65BQG
GS882Z18BGD-150T ZBT SRAM, 256KX18, 7.5ns, CMOS, PBGA165, 15 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology IS61NLP25618A-200B3LI vs GS882Z18BGD-150T

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