There are no models available for this part yet.
Overview of IS61SP12836-166B by Integrated Silicon Solution Inc
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 1 listing )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
ADUM4166BRIZ-RL | Analog Devices | 5kV 480Mbps USB Dig Isolator P | |
AD9166BBPZ | Analog Devices | 16-bit 12GSPS RF DAC with Inte | |
ADUM3166BRSZ-RL | Analog Devices | 3.75kV 480Mbps USB Dig Isolato |
Price & Stock for IS61SP12836-166B by Integrated Silicon Solution Inc
Part # | Manufacturer | Description | Stock | Price | Buy | ||
---|---|---|---|---|---|---|---|
DISTI #
IS61SP12836-166B
|
Avnet Silica | (Alt: IS61SP12836-166B) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 14 Weeks, 0 Days | Silica - 0 |
|
Buy Now |
CAD Models for IS61SP12836-166B by Integrated Silicon Solution Inc
Part Data Attributes for IS61SP12836-166B by Integrated Silicon Solution Inc
|
|
---|---|
Pbfree Code
|
No
|
Rohs Code
|
No
|
Part Life Cycle Code
|
Obsolete
|
Ihs Manufacturer
|
INTEGRATED SILICON SOLUTION INC
|
Part Package Code
|
BGA
|
Package Description
|
PLASTIC, BGA-119
|
Pin Count
|
119
|
Reach Compliance Code
|
compliant
|
ECCN Code
|
3A991.B.2.A
|
HTS Code
|
8542.32.00.41
|
Access Time-Max
|
3.5 ns
|
Additional Feature
|
SELF-TIMED WRITE; BURST COUNTER; BYTE WRITE; LINEAR/INTERLEAVED BURST SEQUENCE
|
Clock Frequency-Max (fCLK)
|
166 MHz
|
I/O Type
|
COMMON
|
JESD-30 Code
|
R-PBGA-B119
|
JESD-609 Code
|
e0
|
Length
|
22 mm
|
Memory Density
|
4718592 bit
|
Memory IC Type
|
CACHE SRAM
|
Memory Width
|
36
|
Number of Functions
|
1
|
Number of Terminals
|
119
|
Number of Words
|
131072 words
|
Number of Words Code
|
128000
|
Operating Mode
|
SYNCHRONOUS
|
Operating Temperature-Max
|
70 °C
|
Operating Temperature-Min
|
|
Organization
|
128KX36
|
Output Characteristics
|
3-STATE
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
BGA
|
Package Equivalence Code
|
BGA119,7X17,50
|
Package Shape
|
RECTANGULAR
|
Package Style
|
GRID ARRAY
|
Parallel/Serial
|
PARALLEL
|
Qualification Status
|
Not Qualified
|
Seated Height-Max
|
2.41 mm
|
Standby Current-Max
|
0.015 A
|
Standby Voltage-Min
|
3.14 V
|
Supply Current-Max
|
0.29 mA
|
Supply Voltage-Max (Vsup)
|
3.63 V
|
Supply Voltage-Min (Vsup)
|
3.135 V
|
Supply Voltage-Nom (Vsup)
|
3.3 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
COMMERCIAL
|
Terminal Finish
|
TIN LEAD
|
Terminal Form
|
BALL
|
Terminal Pitch
|
1.27 mm
|
Terminal Position
|
BOTTOM
|
Width
|
14 mm
|