Part Details for IS64LPS102436B-166B2LA3 by Integrated Silicon Solution Inc
Overview of IS64LPS102436B-166B2LA3 by Integrated Silicon Solution Inc
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (1 replacement)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for IS64LPS102436B-166B2LA3
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
IS64LPS102436B-166
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Avnet Americas | SRAM Chip Sync Quad 3.3V 36M-Bit 1M x 36 3.8ns 119-Pin BGA - Bulk (Alt: IS64LPS102436B-166) RoHS: Not Compliant Min Qty: 84 Package Multiple: 84 Lead time: 12 Weeks, 0 Days Container: Bulk | 0 |
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RFQ |
Part Details for IS64LPS102436B-166B2LA3
IS64LPS102436B-166B2LA3 CAD Models
IS64LPS102436B-166B2LA3 Part Data Attributes
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IS64LPS102436B-166B2LA3
Integrated Silicon Solution Inc
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Datasheet
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IS64LPS102436B-166B2LA3
Integrated Silicon Solution Inc
Cache SRAM, 1MX36, 3.8ns, CMOS, PBGA119, BGA-119
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
| Part Package Code | BGA | |
| Package Description | HBGA, BGA119,7X17,50 | |
| Pin Count | 119 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Factory Lead Time | 12 Weeks | |
| Access Time-Max | 3.8 ns | |
| Clock Frequency-Max (fCLK) | 166 MHz | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PBGA-B119 | |
| JESD-609 Code | e1 | |
| Length | 22 mm | |
| Memory Density | 37748736 bit | |
| Memory IC Type | CACHE SRAM | |
| Memory Width | 36 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 119 | |
| Number of Words | 1048576 words | |
| Number of Words Code | 1000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 1MX36 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HBGA | |
| Package Equivalence Code | BGA119,7X17,50 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Screening Level | AEC-Q100 | |
| Seated Height-Max | 3.5 mm | |
| Standby Voltage-Min | 3.14 V | |
| Supply Voltage-Max (Vsup) | 3.465 V | |
| Supply Voltage-Min (Vsup) | 3.135 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 14 mm |
Alternate Parts for IS64LPS102436B-166B2LA3
This table gives cross-reference parts and alternative options found for IS64LPS102436B-166B2LA3. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of IS64LPS102436B-166B2LA3, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| IS64LPS102436B-166B2A3 | Cache SRAM, 1MX36, 3.8ns, CMOS, PBGA119, BGA-119 | Integrated Silicon Solution Inc | IS64LPS102436B-166B2LA3 vs IS64LPS102436B-166B2A3 |