Part Details for J3A081GUA/T1AG2511 by NXP Semiconductors
Overview of J3A081GUA/T1AG2511 by NXP Semiconductors
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Not Available)
- Reference Designs: (Not Available)
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Price & Stock for J3A081GUA/T1AG2511
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DISTI #
J3A081GUA/T1AG2511
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Avnet Americas | J3A081GUA/UNCASED/FOIL//T1AG25 - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: J3A081GUA/T1AG2511) RoHS: Not Compliant Min Qty: 88250 Package Multiple: 88250 Container: Waffle Pack | 0 |
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RFQ |