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Overview of JZ58F0085M0Y0GF by Micron Technology Inc
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- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Automotive
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
CAD Models for JZ58F0085M0Y0GF by Micron Technology Inc
Part Data Attributes for JZ58F0085M0Y0GF by Micron Technology Inc
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|---|---|
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Pbfree Code
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Yes
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Rohs Code
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Yes
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Part Life Cycle Code
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Obsolete
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Ihs Manufacturer
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MICRON TECHNOLOGY INC
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Part Package Code
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BGA
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Package Description
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VFBGA,
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Pin Count
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104
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Reach Compliance Code
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compliant
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ECCN Code
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EAR99
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HTS Code
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8542.32.00.71
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Additional Feature
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PSRAM DIE DENSITY-128 MBIT
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JESD-30 Code
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S-PBGA-B104
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Length
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10 mm
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Memory Density
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536870912 bit
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Memory IC Type
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MEMORY CIRCUIT
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Memory Width
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16
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Number of Functions
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1
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Number of Terminals
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104
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Number of Words
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33554432 words
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Number of Words Code
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32000000
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Operating Mode
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SYNCHRONOUS
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Organization
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32MX16
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Package Body Material
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PLASTIC/EPOXY
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Package Code
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VFBGA
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Package Shape
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SQUARE
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Package Style
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GRID ARRAY, VERY THIN PROFILE, FINE PITCH
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Peak Reflow Temperature (Cel)
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260
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Seated Height-Max
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0.9 mm
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Supply Voltage-Max (Vsup)
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1.95 V
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Supply Voltage-Min (Vsup)
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1.7 V
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Supply Voltage-Nom (Vsup)
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1.8 V
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Surface Mount
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YES
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Technology
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CMOS
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Terminal Form
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BALL
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Terminal Pitch
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0.65 mm
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Terminal Position
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BOTTOM
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Time@Peak Reflow Temperature-Max (s)
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30
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Width
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10 mm
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