Part Details for JZ58F0101M0Y0GF by Micron Technology Inc
Overview of JZ58F0101M0Y0GF by Micron Technology Inc
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Part Details for JZ58F0101M0Y0GF
JZ58F0101M0Y0GF CAD Models
JZ58F0101M0Y0GF Part Data Attributes
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JZ58F0101M0Y0GF
Micron Technology Inc
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Datasheet
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JZ58F0101M0Y0GF
Micron Technology Inc
Memory Circuit, 32MX16, CMOS, PBGA104, 10 X 10 MM, 1.10 MM HEIGHT, ROHS COMPLIANT, SCSP-104
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | MICRON TECHNOLOGY INC | |
Part Package Code | BGA | |
Package Description | TFBGA, | |
Pin Count | 104 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.71 | |
Additional Feature | PSRAM DIE DENSITY-256 MBIT | |
JESD-30 Code | S-PBGA-B104 | |
Length | 10 mm | |
Memory Density | 536870912 bit | |
Memory IC Type | MEMORY CIRCUIT | |
Memory Width | 16 | |
Number of Functions | 1 | |
Number of Terminals | 104 | |
Number of Words | 33554432 words | |
Number of Words Code | 32000000 | |
Operating Mode | SYNCHRONOUS | |
Organization | 32MX16 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFBGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Seated Height-Max | 1.1 mm | |
Supply Voltage-Max (Vsup) | 1.95 V | |
Supply Voltage-Min (Vsup) | 1.7 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Form | BALL | |
Terminal Pitch | 0.65 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 10 mm |