Part Details for JZ58F0112M0Q0GE by Micron Technology Inc
Overview of JZ58F0112M0Q0GE by Micron Technology Inc
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for JZ58F0112M0Q0GE
JZ58F0112M0Q0GE CAD Models
JZ58F0112M0Q0GE Part Data Attributes
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JZ58F0112M0Q0GE
Micron Technology Inc
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Datasheet
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JZ58F0112M0Q0GE
Micron Technology Inc
Memory Circuit, 64MX16, CMOS, PBGA104, 10 X 10 MM, 1.10 MM HEIGHT, ROHS COMPLIANT, SCSP-104
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | MICRON TECHNOLOGY INC | |
Part Package Code | BGA | |
Package Description | TFBGA, | |
Pin Count | 104 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.71 | |
Additional Feature | PSRAM DIE DENSITY-256 MBIT | |
JESD-30 Code | S-PBGA-B104 | |
Length | 10 mm | |
Memory Density | 1073741824 bit | |
Memory IC Type | MEMORY CIRCUIT | |
Memory Width | 16 | |
Number of Functions | 1 | |
Number of Terminals | 104 | |
Number of Words | 67108864 words | |
Number of Words Code | 64000000 | |
Operating Mode | SYNCHRONOUS | |
Organization | 64MX16 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFBGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Seated Height-Max | 1.1 mm | |
Supply Voltage-Max (Vsup) | 1.95 V | |
Supply Voltage-Min (Vsup) | 1.7 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Form | BALL | |
Terminal Pitch | 0.65 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 10 mm |