There are no models available for this part yet.
Overview of K6T0808C1D-TB70 by Samsung Semiconductor
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 1 listing )
- Number of FFF Equivalents: ( 4 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 4 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Computing and Data Storage
Price & Stock for K6T0808C1D-TB70 by Samsung Semiconductor
Part # | Manufacturer | Description | Stock | Price | Buy | ||
---|---|---|---|---|---|---|---|
Bristol Electronics | 2305 |
|
RFQ |
CAD Models for K6T0808C1D-TB70 by Samsung Semiconductor
Part Data Attributes for K6T0808C1D-TB70 by Samsung Semiconductor
|
|
---|---|
Rohs Code
|
No
|
Part Life Cycle Code
|
Obsolete
|
Ihs Manufacturer
|
SAMSUNG SEMICONDUCTOR INC
|
Part Package Code
|
TSOP
|
Package Description
|
8 X 13.40 MM, TSOP1-28
|
Pin Count
|
28
|
Reach Compliance Code
|
unknown
|
ECCN Code
|
EAR99
|
HTS Code
|
8542.32.00.41
|
Access Time-Max
|
70 ns
|
I/O Type
|
COMMON
|
JESD-30 Code
|
R-PDSO-G28
|
JESD-609 Code
|
e0
|
Length
|
11.8 mm
|
Memory Density
|
262144 bit
|
Memory IC Type
|
STANDARD SRAM
|
Memory Width
|
8
|
Number of Functions
|
1
|
Number of Terminals
|
28
|
Number of Words
|
32768 words
|
Number of Words Code
|
32000
|
Operating Mode
|
ASYNCHRONOUS
|
Operating Temperature-Max
|
70 °C
|
Operating Temperature-Min
|
|
Organization
|
32KX8
|
Output Characteristics
|
3-STATE
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
TSOP1
|
Package Equivalence Code
|
TSSOP28,.53,22
|
Package Shape
|
RECTANGULAR
|
Package Style
|
SMALL OUTLINE, THIN PROFILE
|
Parallel/Serial
|
PARALLEL
|
Qualification Status
|
Not Qualified
|
Seated Height-Max
|
1.2 mm
|
Standby Voltage-Min
|
2 V
|
Supply Current-Max
|
0.06 mA
|
Supply Voltage-Max (Vsup)
|
5.5 V
|
Supply Voltage-Min (Vsup)
|
4.5 V
|
Supply Voltage-Nom (Vsup)
|
5 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
COMMERCIAL
|
Terminal Finish
|
TIN LEAD
|
Terminal Form
|
GULL WING
|
Terminal Pitch
|
0.55 mm
|
Terminal Position
|
DUAL
|
Width
|
8 mm
|
Alternate Parts for K6T0808C1D-TB70
This table gives cross-reference parts and alternative options found for K6T0808C1D-TB70. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of K6T0808C1D-TB70, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
HY62CT08081E-DT70C | Standard SRAM, 32KX8, 70ns, CMOS, PDSO28, 8 X 13.40 MM, TSOP1-28 | SK Hynix Inc | K6T0808C1D-TB70 vs HY62CT08081E-DT70C |
W24257Q-70L | Standard SRAM, 32KX8, 70ns, CMOS, PDSO28, 8 X 13.40 MM, TSOP1-28 | Winbond Electronics Corp | K6T0808C1D-TB70 vs W24257Q-70L |
W24256Q-70LL | Standard SRAM, 32KX8, 70ns, CMOS, PDSO28, 8 X 13.40 MM, TSOP1-28 | Winbond Electronics Corp | K6T0808C1D-TB70 vs W24256Q-70LL |
K6T0808C1D-TL70 | Standard SRAM, 32KX8, 70ns, CMOS, PDSO28, 8 X 13.40 MM, TSOP1-28 | Samsung Semiconductor | K6T0808C1D-TB70 vs K6T0808C1D-TL70 |