Part Details for LD27128 by Intel Corporation
Overview of LD27128 by Intel Corporation
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- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
- Reference Designs:
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Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Aerospace and Defense
Part Details for LD27128
LD27128 CAD Models
LD27128 Part Data Attributes
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LD27128
Intel Corporation
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Datasheet
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LD27128
Intel Corporation
UVPROM, 16KX8, 250ns, CMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INTEL CORP | |
| Part Package Code | DIP | |
| Package Description | HERMETIC SEALED, CERAMIC, DIP-28 | |
| Pin Count | 28 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 250 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-GDIP-T28 | |
| JESD-609 Code | e0 | |
| Length | 37.084 mm | |
| Memory Density | 131072 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 16384 words | |
| Number of Words Code | 16000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 16KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | WDIP | |
| Package Equivalence Code | DIP28,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE, WINDOW | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 21 V | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.08 mm | |
| Supply Current-Max | 0.14 mA | |
| Supply Voltage-Max (Vsup) | 5.25 V | |
| Supply Voltage-Min (Vsup) | 4.75 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for LD27128
This table gives cross-reference parts and alternative options found for LD27128. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of LD27128, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| AM27C128-255DC | UVPROM, 16KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | LD27128 vs AM27C128-255DC |
| DQ27128-25 | UVPROM, 16KX8, 250ns, MOS, CDIP28, | LSI Corporation | LD27128 vs DQ27128-25 |
| NMC27C128BQ250 | 16KX8 UVPROM, 250ns, CDIP28, WINDOWED, CERAMIC, DIP-28 | Texas Instruments | LD27128 vs NMC27C128BQ250 |
| AM27C128-255DEB | UVPROM, 16KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | LD27128 vs AM27C128-255DEB |
| AM27128A-25DIB | UVPROM, 16KX8, 250ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | AMD | LD27128 vs AM27128A-25DIB |
| 27C128-25/J | 16K X 8 UVPROM, 250 ns, CDIP28, 0.600 INCH, CERDIP-28 | Microchip Technology Inc | LD27128 vs 27C128-25/J |
| AM27C128-250DCB | UVPROM, 16KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | LD27128 vs AM27C128-250DCB |
| 5962-8766106XX | UVPROM, 16KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | LD27128 vs 5962-8766106XX |
| AM27C128-250DI | UVPROM, 16KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | LD27128 vs AM27C128-250DI |
| AM27C128-250/BXA | UVPROM, 16KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | LD27128 vs AM27C128-250/BXA |