Part Details for LM3S2139-IBZ25-A2 by Texas Instruments
Overview of LM3S2139-IBZ25-A2 by Texas Instruments
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for LM3S2139-IBZ25-A2
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2156-LM3S2139-IBZ25-A2-TI-ND
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DigiKey | IC MCU 32BIT 64KB FLASH 108BGA Min Qty: 20 Lead time: 40 Weeks Container: Tray MARKETPLACE PRODUCT |
184 In Stock |
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$15.5800 | Buy Now |
DISTI #
296-25685-ND
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DigiKey | IC MCU 32BIT 64KB FLASH 108BGA Min Qty: 20 Lead time: 40 Weeks Container: Tray | Limited Supply - Call |
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$18.5408 | Buy Now |
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Rochester Electronics | Stellaris, RISC ARM Cortex-M3 Microcontroller, 32-Bit, FLASH, 25MHz, PBGA108 ' RoHS: Compliant Status: Obsolete Min Qty: 1 | 184 |
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$13.3700 / $15.7300 | Buy Now |
Part Details for LM3S2139-IBZ25-A2
LM3S2139-IBZ25-A2 CAD Models
LM3S2139-IBZ25-A2 Part Data Attributes
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LM3S2139-IBZ25-A2
Texas Instruments
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Datasheet
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LM3S2139-IBZ25-A2
Texas Instruments
Stellaris LM3S Microcontroller 108-NFBGA -40 to 85
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
Part Package Code | BGA | |
Package Description | BGA-108 | |
Pin Count | 108 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.31.00.01 | |
Has ADC | YES | |
Address Bus Width | 8 | |
Bit Size | 32 | |
Boundary Scan | NO | |
Clock Frequency-Max | 25 MHz | |
DAC Channels | NO | |
DMA Channels | YES | |
External Data Bus Width | 32 | |
JESD-30 Code | S-PBGA-B108 | |
JESD-609 Code | e1 | |
Length | 10 mm | |
Moisture Sensitivity Level | 3 | |
Number of I/O Lines | 56 | |
Number of Terminals | 108 | |
On Chip Program ROM Width | 8 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
PWM Channels | YES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFBGA | |
Package Equivalence Code | BGA108,12X12,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
RAM (bytes) | 16384 | |
ROM (words) | 65536 | |
ROM Programmability | FLASH | |
Seated Height-Max | 1.5 mm | |
Speed | 25 MHz | |
Supply Voltage-Max | 2.75 V | |
Supply Voltage-Min | 2.5 V | |
Supply Voltage-Nom | 2.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 10 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |