Part Details for LMV228URX by National Semiconductor Corporation
Overview of LMV228URX by National Semiconductor Corporation
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Applications
Consumer Electronics
Part Details for LMV228URX
LMV228URX CAD Models
LMV228URX Part Data Attributes
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LMV228URX
National Semiconductor Corporation
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LMV228URX
National Semiconductor Corporation
IC TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, PBGA4, 1 X 1 MM, 0.35 MM HEIGHT, LEAD FREE, MICRO SMD-4, Cellular Telephone Circuit
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Rohs Code | No | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | NATIONAL SEMICONDUCTOR CORP | |
Package Description | 1 X 1 MM, 0.35 MM HEIGHT, LEAD FREE, MICRO SMD-4 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 | |
JESD-30 Code | S-PBGA-B4 | |
JESD-609 Code | e0 | |
Length | 0.975 mm | |
Moisture Sensitivity Level | 1 | |
Number of Functions | 1 | |
Number of Terminals | 4 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | VFBGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 0.425 mm | |
Supply Voltage-Nom | 2.7 V | |
Surface Mount | YES | |
Telecom IC Type | RF AND BASEBAND CIRCUIT | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 0.5 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 0.975 mm |