There are no models available for this part yet.
Overview of LPC1112FHN33/101,551 by NXP Semiconductors
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 2 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Consumer Electronics
Internet of Things (IoT)
Industrial Automation
Smart Cities
Renewable Energy
Robotics and Drones
Price & Stock for LPC1112FHN33/101,551 by NXP Semiconductors
| Part # | Manufacturer | Description | Stock | Price | Buy | ||
|---|---|---|---|---|---|---|---|
|
DISTI #
LPC1112FHN33/101,5
|
Avnet Americas | MCU 32-bit LPC1100 ARM Cortex M0 RISC 16KB Flash 3.3V 32-Pin HVQFN EP Tray - Trays (Alt: LPC1112FHN33/101,5) RoHS: Compliant Min Qty: 260 Package Multiple: 1 Lead time: 13 Weeks, 0 Days Container: Tray | 260 |
|
$1.3260 | Buy Now | |
|
DISTI #
LPC1112FHN33/101,5
|
Avnet Silica | MCU 32-Bit LPC1112 ARM Cortex-M0 RISC 16KB Flash 1.8V to 3.6V 32-Pin HVQFN Tray (Alt: LPC1112FHN33/101,5) RoHS: Compliant Min Qty: 260 Package Multiple: 260 Lead time: 15 Weeks, 0 Days | Silica - 0 |
|
Buy Now |
CAD Models for LPC1112FHN33/101,551 by NXP Semiconductors
Part Data Attributes for LPC1112FHN33/101,551 by NXP Semiconductors
|
|
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|---|---|
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Part Life Cycle Code
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Active
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|
Ihs Manufacturer
|
NXP SEMICONDUCTORS
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|
Package Description
|
,
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Reach Compliance Code
|
unknown
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HTS Code
|
8542.31.00.01
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Factory Lead Time
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13 Weeks
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Has ADC
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YES
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Address Bus Width
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|
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Bit Size
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32
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Boundary Scan
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NO
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CPU Family
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CORTEX-M0
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Clock Frequency-Max
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25 MHz
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DAC Channels
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NO
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DMA Channels
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NO
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External Data Bus Width
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|
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Format
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FIXED POINT
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Integrated Cache
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NO
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JESD-30 Code
|
S-PQCC-N32
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Length
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7 mm
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Low Power Mode
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YES
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Number of I/O Lines
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28
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Number of Serial I/Os
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1
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Number of Terminals
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33
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Number of Timers
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5
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On Chip Data RAM Width
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8
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On Chip Program ROM Width
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8
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Operating Temperature-Max
|
85 °C
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Operating Temperature-Min
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-40 °C
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PWM Channels
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NO
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Package Body Material
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PLASTIC/EPOXY
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Package Code
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HVQCCN
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Package Equivalence Code
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LCC32,.27SQ,25
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Package Shape
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SQUARE
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Package Style
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CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
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RAM (bytes)
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2048
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ROM (words)
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16384
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ROM Programmability
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FLASH
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Seated Height-Max
|
1 mm
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Speed
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50 MHz
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Supply Current-Max
|
100 mA
|
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Supply Voltage-Max
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3.6 V
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Supply Voltage-Min
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3.3 V
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Supply Voltage-Nom
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3.3 V
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Surface Mount
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YES
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Technology
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CMOS
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Terminal Form
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NO LEAD
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Terminal Pitch
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0.65 mm
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Terminal Position
|
QUAD
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Width
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7 mm
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uPs/uCs/Peripheral ICs Type
|
MICROCONTROLLER, RISC
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