Part Details for LPC1113FHN33/302K by NXP Semiconductors
Overview of LPC1113FHN33/302K by NXP Semiconductors
- Distributor Offerings: (6 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
56604-302KLF | Amphenol Communications Solutions | Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Vertical, Surface Mount, Dual Entry,Double Row, Selective Loaded, 18 Position ,2.54mm (0.100in) Pitch | |
10143702-302KLF | Amphenol Communications Solutions | Minitek MicroSpace™ 1.27mm Crimp-to-Wire Connector Platform, Wire to Board Connector, Horizontal, Header, Surface Mount, 2 Position<br><br>(For product qualification latest status, please submit <a href=\\javascript:;\\ class=\\button product-enquiry\\ style=\\background: none;color: red;\\><span>Product Enquiry</span></a>) | |
10143746-302KLF | Amphenol Communications Solutions | Minitek MicroSpace™ 1.27mm Crimp-to-Wire Connector Platform, Wire to Board Connector, Horizontal, Header, Surface Mount, 2 Position,side to side,side latch<br><br>(For product qualification latest status, please submit <a href=\\javascript:;\\ class=\\button product-enquiry\\ style=\\background: none;color: red;\\><span>Product Enquiry</span></a>) |
Price & Stock for LPC1113FHN33/302K
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
55W6723
|
Newark | Scalable Entry Level 32-Bit Microcontroller (Mcu) Based On Arm Cortex-M0+/M0 Cores/ Tray Rohs Compliant: Yes |Nxp LPC1113FHN33/302K RoHS: Compliant Min Qty: 1300 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
|
$1.7500 | Buy Now |
DISTI #
LPC1113FHN33/302K-ND
|
DigiKey | IC MCU 32BIT 24KB FLASH 32HVQFN Min Qty: 1300 Lead time: 13 Weeks Container: Tray | Temporarily Out of Stock |
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$1.8001 | Buy Now |
DISTI #
LPC1113FHN33/302K
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Avnet Americas | MCU 32-bit LPC1100L ARM Cortex M0 RISC 24KB Flash 3.3V 33-Pin HVQFN EP Tray - Trays (Alt: LPC1113FHN33/302K) RoHS: Compliant Min Qty: 1300 Package Multiple: 1300 Lead time: 13 Weeks, 0 Days Container: Tray | 0 |
|
$1.9497 | Buy Now |
DISTI #
771-LPC1113FHN33302K
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Mouser Electronics | ARM Microcontrollers - MCU Scalable Entry Level 32-bit Microcontroller (MCU) based on ARM Cortex-M0+/M0 Cores RoHS: Compliant | 0 |
|
$1.9600 / $2.0100 | Order Now |
|
Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 1300 Package Multiple: 1300 Lead time: 13 Weeks Container: Tray | 0Tray |
|
$1.6500 | Buy Now |
DISTI #
LPC1113FHN33/302K
|
EBV Elektronik | MCU 32-bit LPC1100L ARM Cortex M0 RISC 24KB Flash 3.3V 33-Pin HVQFN EP Tray (Alt: LPC1113FHN33/302K) RoHS: Compliant Min Qty: 1300 Package Multiple: 1300 Lead time: 15 Weeks, 0 Days | EBV - 0 |
|
Buy Now |
Part Details for LPC1113FHN33/302K
LPC1113FHN33/302K CAD Models
LPC1113FHN33/302K Part Data Attributes
|
LPC1113FHN33/302K
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
LPC1113FHN33/302K
NXP Semiconductors
LPC1113FHN33 - 24kB flash, 8kB SRAM, HVQFN32 package QFN 32-Pin
|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Part Package Code | QFN | |
Package Description | HVQCCN, LCC32,.27SQ,25 | |
Pin Count | 32 | |
Manufacturer Package Code | SOT865-3 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Factory Lead Time | 13 Weeks | |
Samacsys Manufacturer | NXP | |
Has ADC | YES | |
Address Bus Width | ||
Bit Size | 32 | |
Boundary Scan | NO | |
CPU Family | CORTEX-M0 | |
Clock Frequency-Max | 25 MHz | |
DAC Channels | NO | |
DMA Channels | NO | |
External Data Bus Width | ||
JESD-30 Code | S-PQCC-N32 | |
Length | 7 mm | |
Moisture Sensitivity Level | 3 | |
Number of I/O Lines | 28 | |
Number of Terminals | 33 | |
On Chip Program ROM Width | 8 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
PWM Channels | NO | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | HVQCCN | |
Package Equivalence Code | LCC32,.27SQ,25 | |
Package Shape | SQUARE | |
Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
RAM (bytes) | 8192 | |
ROM (words) | 24576 | |
ROM Programmability | FLASH | |
Speed | 50 MHz | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3.3 V | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | NO LEAD | |
Terminal Pitch | 0.65 mm | |
Terminal Position | QUAD | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 7 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |