Part Details for LPC1114FHN33/303Y by NXP Semiconductors
Overview of LPC1114FHN33/303Y by NXP Semiconductors
- Distributor Offerings: (7 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for LPC1114FHN33/303Y
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
LPC1114FHN33/303Y-ND
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DigiKey | IC MCU 32BIT 32KB FLASH 32HVQFN Min Qty: 4000 Lead time: 13 Weeks Container: Tape & Reel (TR) | Temporarily Out of Stock |
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$2.2571 | Buy Now |
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DISTI #
LPC1114FHN33/303Y
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Avnet Americas | MCU 32-Bit LPC1114 ARM Cortex M0 RISC 32KB Flash 2.5V/3.3V 33-Pin HVQFN T/R - Tape and Reel (Alt: LPC1114FHN33/303Y) RoHS: Compliant Min Qty: 4000 Package Multiple: 4000 Lead time: 13 Weeks, 0 Days Container: Reel | 0 |
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$1.8264 / $2.0163 | Buy Now |
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DISTI #
771-LPC1114FHN33303Y
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Mouser Electronics | ARM Microcontrollers - MCU 32kB flash, 8kB SRAM, HVQFN32 package RoHS: Compliant | 0 |
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$2.1700 | Order Now |
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Future Electronics | 32-bit MCU 32kB flash, 8kB SRAM, HVQFN32 package RoHS: Compliant pbFree: Yes Min Qty: 4000 Package Multiple: 4000 Container: Reel | 0Reel |
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$1.9800 | Buy Now |
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DISTI #
LPC1114FHN33/303Y
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Avnet Americas | MCU 32-Bit LPC1114 ARM Cortex M0 RISC 32KB Flash 2.5V/3.3V 33-Pin HVQFN T/R - Tape and Reel (Alt: LPC1114FHN33/303Y) RoHS: Compliant Min Qty: 4000 Package Multiple: 4000 Lead time: 13 Weeks, 0 Days Container: Reel | 0 |
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$1.8264 / $2.0163 | Buy Now |
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DISTI #
LPC1114FHN33/303Y
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EBV Elektronik | (Alt: LPC1114FHN33/303Y) RoHS: Compliant Min Qty: 4000 Package Multiple: 4000 Lead time: 2 Weeks, 1 Days | EBV - 0 |
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Buy Now | |
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Flip Electronics | Stock | 4000 |
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RFQ |
Part Details for LPC1114FHN33/303Y
LPC1114FHN33/303Y CAD Models
LPC1114FHN33/303Y Part Data Attributes:
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LPC1114FHN33/303Y
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
LPC1114FHN33/303Y
NXP Semiconductors
LPC1114FHN33 - 32kB flash, 8kB SRAM, HVQFN32 package QFN 32-Pin
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Part Package Code | QFN | |
| Package Description | HVQCCN, | |
| Pin Count | 32 | |
| Manufacturer Package Code | SOT865-3 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 13 Weeks | |
| Samacsys Manufacturer | NXP | |
| Has ADC | YES | |
| Address Bus Width | ||
| Bit Size | 32 | |
| CPU Family | CORTEX-M0 | |
| Clock Frequency-Max | 25 MHz | |
| DAC Channels | NO | |
| DMA Channels | NO | |
| External Data Bus Width | ||
| Length | 7 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of I/O Lines | 28 | |
| Number of Terminals | 33 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | NO | |
| Package Code | HVQCCN | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Peak Reflow Temperature (Cel) | 260 | |
| RAM (bytes) | 8192 | |
| ROM (words) | 32768 | |
| ROM Programmability | FLASH | |
| Speed | 50 MHz | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3.3 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 7 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |