Part Details for LPC1114FHN33/201,551 by NXP Semiconductors
Overview of LPC1114FHN33/201,551 by NXP Semiconductors
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- Part Data Attributes
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Price & Stock for LPC1114FHN33/201,551
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
LPC1114FHN33/201,5
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Avnet Americas | MCU 32-bit LPC1100 ARM Cortex M0 RISC 32KB Flash 3.3V 32-Pin HVQFN EP Tray - Trays (Alt: LPC1114FHN33/201,5) RoHS: Compliant Min Qty: 520 Package Multiple: 260 Lead time: 13 Weeks, 0 Days Container: Tray | 0 |
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RFQ | |
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DISTI #
LPC1114FHN33/201,5
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Avnet Americas | MCU 32-bit LPC1100 ARM Cortex M0 RISC 32KB Flash 3.3V 32-Pin HVQFN EP Tray - Trays (Alt: LPC1114FHN33/201,5) RoHS: Compliant Min Qty: 520 Package Multiple: 260 Lead time: 13 Weeks, 0 Days Container: Tray | 0 |
|
RFQ | |
|
DISTI #
LPC1114FHN33/201,5
|
Avnet Americas | MCU 32-bit LPC1100 ARM Cortex M0 RISC 32KB Flash 3.3V 32-Pin HVQFN EP Tray - Trays (Alt: LPC1114FHN33/201,5) RoHS: Compliant Min Qty: 520 Package Multiple: 260 Lead time: 13 Weeks, 0 Days Container: Tray | 0 |
|
RFQ | |
|
DISTI #
LPC1114FHN33/201,5
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Avnet Silica | MCU 32-bit LPC1100 ARM Cortex M0 RISC 32KB Flash 3.3V 32-Pin HVQFN EP Tray (Alt: LPC1114FHN33/201,5) RoHS: Compliant Min Qty: 260 Package Multiple: 260 Lead time: 2 Weeks, 1 Days | Silica - 0 |
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Buy Now |
Part Details for LPC1114FHN33/201,551
LPC1114FHN33/201,551 CAD Models
LPC1114FHN33/201,551 Part Data Attributes
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LPC1114FHN33/201,551
NXP Semiconductors
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Datasheet
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LPC1114FHN33/201,551
NXP Semiconductors
RISC Microcontroller
|
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | , | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 13 Weeks | |
| Has ADC | YES | |
| Address Bus Width | ||
| Bit Size | 32 | |
| Boundary Scan | NO | |
| CPU Family | CORTEX-M0 | |
| Clock Frequency-Max | 25 MHz | |
| DAC Channels | NO | |
| DMA Channels | NO | |
| External Data Bus Width | ||
| Format | FIXED POINT | |
| Integrated Cache | NO | |
| JESD-30 Code | S-PQCC-N32 | |
| Length | 7 mm | |
| Low Power Mode | YES | |
| Number of I/O Lines | 28 | |
| Number of Serial I/Os | 1 | |
| Number of Terminals | 33 | |
| Number of Timers | 5 | |
| On Chip Data RAM Width | 8 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | NO | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HVQCCN | |
| Package Equivalence Code | LCC32,.27SQ,25 | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
| RAM (bytes) | 4096 | |
| ROM (words) | 32768 | |
| ROM Programmability | FLASH | |
| Seated Height-Max | 1 mm | |
| Speed | 50 MHz | |
| Supply Current-Max | 100 mA | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 1.8 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | QUAD | |
| Width | 7 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |