Part Details for LPC11U23FBD48/301 by NXP Semiconductors
Overview of LPC11U23FBD48/301 by NXP Semiconductors
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Part Details for LPC11U23FBD48/301
LPC11U23FBD48/301 CAD Models
LPC11U23FBD48/301 Part Data Attributes
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LPC11U23FBD48/301
NXP Semiconductors
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Datasheet
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LPC11U23FBD48/301
NXP Semiconductors
IC 32-BIT, FLASH, 50 MHz, RISC MICROCONTROLLER, PQFP48, 7 X 7 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT313-2, LQFP-48, Microcontroller
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Part Package Code | QFP | |
Package Description | 7 X 7 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT313-2, LQFP-48 | |
Pin Count | 48 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Samacsys Manufacturer | NXP | |
Has ADC | YES | |
Address Bus Width | ||
Bit Size | 32 | |
CPU Family | CORTEX-M0 | |
Clock Frequency-Max | 25 MHz | |
DAC Channels | NO | |
DMA Channels | NO | |
External Data Bus Width | ||
JESD-30 Code | S-PQFP-G48 | |
Length | 7 mm | |
Moisture Sensitivity Level | 1 | |
Number of I/O Lines | 40 | |
Number of Terminals | 48 | |
On Chip Program ROM Width | 8 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
PWM Channels | NO | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFQFP | |
Package Equivalence Code | QFP48,.35SQ,20 | |
Package Shape | SQUARE | |
Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
RAM (bytes) | 6144 | |
ROM (words) | 24576 | |
ROM Programmability | FLASH | |
Seated Height-Max | 1.6 mm | |
Speed | 50 MHz | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3.3 V | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.5 mm | |
Terminal Position | QUAD | |
Width | 7 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |