Datasheets
LPC11U23FBD48/301 by: NXP Semiconductors

IC 32-BIT, FLASH, 50 MHz, RISC MICROCONTROLLER, PQFP48, 7 X 7 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT313-2, LQFP-48, Microcontroller

Part Details for LPC11U23FBD48/301 by NXP Semiconductors

Overview of LPC11U23FBD48/301 by NXP Semiconductors

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Applications Education and Research Aerospace and Defense Agriculture Technology Robotics and Drones

Part Details for LPC11U23FBD48/301

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LPC11U23FBD48/301 Part Data Attributes

LPC11U23FBD48/301 NXP Semiconductors
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LPC11U23FBD48/301 NXP Semiconductors IC 32-BIT, FLASH, 50 MHz, RISC MICROCONTROLLER, PQFP48, 7 X 7 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT313-2, LQFP-48, Microcontroller
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer NXP SEMICONDUCTORS
Part Package Code QFP
Package Description 7 X 7 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT313-2, LQFP-48
Pin Count 48
Reach Compliance Code compliant
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Samacsys Manufacturer NXP
Has ADC YES
Address Bus Width
Bit Size 32
CPU Family CORTEX-M0
Clock Frequency-Max 25 MHz
DAC Channels NO
DMA Channels NO
External Data Bus Width
JESD-30 Code S-PQFP-G48
Length 7 mm
Moisture Sensitivity Level 1
Number of I/O Lines 40
Number of Terminals 48
On Chip Program ROM Width 8
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
PWM Channels NO
Package Body Material PLASTIC/EPOXY
Package Code LFQFP
Package Equivalence Code QFP48,.35SQ,20
Package Shape SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
RAM (bytes) 6144
ROM (words) 24576
ROM Programmability FLASH
Seated Height-Max 1.6 mm
Speed 50 MHz
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3.3 V
Supply Voltage-Nom 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form GULL WING
Terminal Pitch 0.5 mm
Terminal Position QUAD
Width 7 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC

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