Part Details for LPC11U24FHI33/301Y by NXP Semiconductors
Overview of LPC11U24FHI33/301Y by NXP Semiconductors
- Distributor Offerings: (10 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Internet of Things (IoT)
Smart Cities
Healthcare
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| ADA4930-1YCPZ-RL | Analog Devices | UltraLow Dist Low Vltg ADC Dri | |
| ADA4930-1YCPZ-R7 | Analog Devices | UltraLow Dist Low Vltg ADC Dri | |
| ADA4930-1YCPZ-R2 | Analog Devices | UltraLow Dist Low Vltg ADC Dri |
Price & Stock for LPC11U24FHI33/301Y
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
11AC3281
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Newark | 32Kb Flash, 6Kb Sram, Hvqfn32 Package/ Reel Rohs Compliant: Yes |Nxp LPC11U24FHI33/301Y RoHS: Compliant Min Qty: 6000 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$2.4700 | Buy Now |
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DISTI #
2832-LPC11U24FHI33/301YTR-ND
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DigiKey | IC MCU 32BIT 32KB FLASH 33HVQFN Min Qty: 300 Lead time: 13 Weeks Container: Tape & Reel (TR) MARKETPLACE PRODUCT |
287760 In Stock |
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$2.4800 | Buy Now |
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DISTI #
LPC11U24FHI33/301Y-ND
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DigiKey | IC MCU 32BIT 32KB FLASH 33HVQFN Min Qty: 300 Lead time: 13 Weeks Container: Tape & Reel (TR) | Temporarily Out of Stock |
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$2.3197 | Buy Now |
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DISTI #
LPC11U24FHI33/301Y
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Avnet Americas | LPC11U24FHI33/301/HVQFN32/REEL - Tape and Reel (Alt: LPC11U24FHI33/301Y) RoHS: Compliant Min Qty: 269 Package Multiple: 1 Lead time: 0 Weeks, 2 Days Container: Reel | 287760 Partner Stock |
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RFQ | |
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DISTI #
LPC11U24FHI33/301Y
|
Avnet Americas | LPC11U24FHI33/301/HVQFN32/REEL - Tape and Reel (Alt: LPC11U24FHI33/301Y) RoHS: Compliant Min Qty: 6000 Package Multiple: 6000 Lead time: 13 Weeks, 0 Days Container: Reel | 0 |
|
$2.6578 | Buy Now |
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DISTI #
771-PC11U24FHI33301Y
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Mouser Electronics | ARM Microcontrollers - MCU 32kB flash, 6kB SRAM, HVQFN32 package RoHS: Compliant | 0 |
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$2.7400 | Order Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 6000 Package Multiple: 6000 Lead time: 13 Weeks Container: Reel | 0Reel |
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$2.3200 | Buy Now |
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DISTI #
LPC11U24FHI33/301Y
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Avnet Silica | LPC11U24FHI33/301/HVQFN32/REEL (Alt: LPC11U24FHI33/301Y) RoHS: Compliant Min Qty: 6000 Package Multiple: 6000 Lead time: 15 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
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DISTI #
LPC11U24FHI33/301Y
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EBV Elektronik | LPC11U24FHI33/301/HVQFN32/REEL (Alt: LPC11U24FHI33/301Y) RoHS: Compliant Min Qty: 6000 Package Multiple: 6000 Lead time: 15 Weeks, 0 Days | EBV - 0 |
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Buy Now | |
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Flip Electronics | Stock, ship today | 291435 |
|
RFQ |
Part Details for LPC11U24FHI33/301Y
LPC11U24FHI33/301Y CAD Models
LPC11U24FHI33/301Y Part Data Attributes
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LPC11U24FHI33/301Y
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
LPC11U24FHI33/301Y
NXP Semiconductors
LPC11U24FHI33 - 32kB flash, 6kB SRAM, HVQFN32 package QFN 32-Pin
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Part Package Code | QFN | |
| Package Description | HVQCCN, | |
| Pin Count | 32 | |
| Manufacturer Package Code | SOT617-3 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 2 Days | |
| Samacsys Manufacturer | NXP | |
| Has ADC | YES | |
| Additional Feature | SEATED HGT-NOM | |
| Address Bus Width | ||
| Bit Size | 32 | |
| CPU Family | CORTEX-M0 | |
| Clock Frequency-Max | 25 MHz | |
| DAC Channels | NO | |
| DMA Channels | NO | |
| External Data Bus Width | ||
| JESD-30 Code | S-PQCC-N33 | |
| Length | 5 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of I/O Lines | 26 | |
| Number of Terminals | 33 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | NO | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HVQCCN | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Peak Reflow Temperature (Cel) | 260 | |
| RAM (bytes) | 8192 | |
| ROM (words) | 32768 | |
| ROM Programmability | FLASH | |
| Seated Height-Max | 0.85 mm | |
| Speed | 50 MHz | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3.3 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 5 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |