Part Details for LPC1313FHN33/01,55 by NXP Semiconductors
Overview of LPC1313FHN33/01,55 by NXP Semiconductors
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Price & Stock for LPC1313FHN33/01,55
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
568-8375-ND
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DigiKey | IC MCU 32BIT 32KB FLASH 32HVQFN Min Qty: 1 Lead time: 13 Weeks Container: Tray |
496 In Stock |
|
$2.8569 / $5.6900 | Buy Now |
DISTI #
LPC1313FHN33/01,55
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Avnet Americas | MCU 32-bit LPC1300 ARM Cortex M3 RISC 32KB Flash 3.3V 33-Pin HVQFN EP Tray - Trays (Alt: LPC1313FHN33/01,55) RoHS: Not Compliant Min Qty: 520 Package Multiple: 260 Lead time: 13 Weeks, 0 Days Container: Tray | 0 |
|
RFQ | |
DISTI #
771-LPC1313FHN330155
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Mouser Electronics | ARM Microcontrollers - MCU 32B CORTEX-M3 32KB FL/8KB SRAM RoHS: Compliant | 520 |
|
$2.8500 / $5.5100 | Buy Now |
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Future Electronics | LPC13xx Series 32 kB Flash 8 kB RAM SMT 32-Bit-Microcontroller - HVQFN-33 RoHS: Compliant pbFree: Yes Min Qty: 520 Package Multiple: 260 Container: Tray | 0Tray |
|
$2.9500 | Buy Now |
DISTI #
LPC1313FHN33/01,55
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Avnet Americas | MCU 32-bit LPC1300 ARM Cortex M3 RISC 32KB Flash 3.3V 33-Pin HVQFN EP Tray - Trays (Alt: LPC1313FHN33/01,55) RoHS: Not Compliant Min Qty: 520 Package Multiple: 260 Lead time: 13 Weeks, 0 Days Container: Tray | 0 |
|
RFQ | |
DISTI #
LPC1313FHN33/01,55
|
Avnet Americas | MCU 32-bit LPC1300 ARM Cortex M3 RISC 32KB Flash 3.3V 33-Pin HVQFN EP Tray - Trays (Alt: LPC1313FHN33/01,55) RoHS: Not Compliant Min Qty: 520 Package Multiple: 260 Lead time: 13 Weeks, 0 Days Container: Tray | 0 |
|
RFQ | |
DISTI #
LPC1313FHN33/01,55
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Avnet Silica | MCU 32-Bit LPC1300 ARM Cortex M3 RISC 32KB Flash 3.3V 32-Pin HVQFN EP Tray (Alt: LPC1313FHN33/01,55) RoHS: Compliant Min Qty: 260 Package Multiple: 260 Lead time: 2 Weeks, 1 Days | Silica - 0 |
|
Buy Now | |
DISTI #
LPC1313FHN33/01,55
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EBV Elektronik | MCU 32-Bit LPC1300 ARM Cortex M3 RISC 32KB Flash 3.3V 32-Pin HVQFN EP Tray (Alt: LPC1313FHN33/01,55) RoHS: Compliant Min Qty: 260 Package Multiple: 260 Lead time: 2 Weeks, 1 Days | EBV - 0 |
|
Buy Now | |
|
Flip Electronics | Stock | 3182 |
|
RFQ |
Part Details for LPC1313FHN33/01,55
LPC1313FHN33/01,55 CAD Models
LPC1313FHN33/01,55 Part Data Attributes
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LPC1313FHN33/01,55
NXP Semiconductors
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Datasheet
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Compare Parts:
LPC1313FHN33/01,55
NXP Semiconductors
LPC1313FHN33 - 32kB Flash, 8kB SRAM QFN 32-Pin
|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Part Package Code | QFN | |
Package Description | HVQFN-33 | |
Pin Count | 32 | |
Manufacturer Package Code | SOT865-3 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Samacsys Manufacturer | NXP | |
Has ADC | YES | |
Address Bus Width | ||
Bit Size | 32 | |
CPU Family | CORTEX-M3 | |
Clock Frequency-Max | 25 MHz | |
DAC Channels | NO | |
DMA Channels | NO | |
External Data Bus Width | ||
JESD-30 Code | S-PQCC-N33 | |
JESD-609 Code | e3 | |
Length | 7 mm | |
Moisture Sensitivity Level | 3 | |
Number of I/O Lines | 28 | |
Number of Terminals | 33 | |
On Chip Program ROM Width | 8 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
PWM Channels | NO | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | HVQCCN | |
Package Equivalence Code | LCC32,.27SQ,25 | |
Package Shape | SQUARE | |
Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
RAM (bytes) | 8192 | |
ROM (words) | 32768 | |
ROM Programmability | FLASH | |
Seated Height-Max | 1 mm | |
Speed | 72 MHz | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 2 V | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Matte Tin (Sn) | |
Terminal Form | NO LEAD | |
Terminal Pitch | 0.65 mm | |
Terminal Position | QUAD | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 7 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |