Part Details for LPC1765FET100,551 by NXP Semiconductors
Overview of LPC1765FET100,551 by NXP Semiconductors
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Internet of Things (IoT)
Smart Cities
Healthcare
Price & Stock for LPC1765FET100,551
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
41T4085
|
Newark | Microcontroller Mcu, 32 Bit, Cortex-M3, 100Mhz, Tfbga-100, Product Range:Lpc Family Lpc1700 Series Microcontrollers, Device Core:Arm Cortex-M3, Data Bus Width:32 Bit, Operating Frequency Max:100Mhz, Program Memory Size:256Kb Rohs Compliant: Yes |Nxp LPC1765FET100,551 RoHS: Compliant Min Qty: 260 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
|
$6.5600 / $6.7100 | Buy Now |
DISTI #
568-7565-ND
|
DigiKey | IC MCU 32BIT 256KB FLSH 100TFBGA Lead time: 13 Weeks Container: Tray | Limited Supply - Call |
|
Buy Now | |
|
Rochester Electronics | LPC1765 - Microcontroller based on Arm Cortex-M3 RoHS: Compliant Status: Active Min Qty: 1 | 3120 |
|
$6.7900 / $7.9900 | Buy Now |
DISTI #
C1S537102938527
|
Chip1Stop | Microcontrollers RoHS: Compliant | 240 |
|
$9.3495 / $14.2405 | Buy Now |
Part Details for LPC1765FET100,551
LPC1765FET100,551 CAD Models
LPC1765FET100,551 Part Data Attributes
|
LPC1765FET100,551
NXP Semiconductors
Buy Now
Datasheet
|
Compare Parts:
LPC1765FET100,551
NXP Semiconductors
LPC1765FET100 - 256kB flash, 64kB SRAM, USB, TFBGA100 package BGA 100-Pin
|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Part Package Code | BGA | |
Package Description | TFBGA-100 | |
Pin Count | 100 | |
Manufacturer Package Code | SOT926-1 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Samacsys Manufacturer | NXP | |
Has ADC | YES | |
Address Bus Width | ||
Bit Size | 32 | |
CPU Family | CORTEX-M3 | |
Clock Frequency-Max | 25 MHz | |
DAC Channels | YES | |
DMA Channels | YES | |
External Data Bus Width | ||
JESD-30 Code | S-PBGA-B100 | |
JESD-609 Code | e1 | |
Length | 9 mm | |
Moisture Sensitivity Level | 3 | |
Number of I/O Lines | 70 | |
Number of Terminals | 100 | |
On Chip Program ROM Width | 8 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
PWM Channels | YES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFBGA | |
Package Equivalence Code | BGA100,10X10,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
RAM (bytes) | 65536 | |
ROM (words) | 262144 | |
ROM Programmability | FLASH | |
Seated Height-Max | 1.2 mm | |
Speed | 100 MHz | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3.3 V | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 9 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |