Datasheets
LPC1767FBD100,551 by: NXP Semiconductors

LPC1767FBD100 - 512kB flash, 64kB SRAM, Ethernet, no CAN, LQFP100 package QFP 100-Pin

Part Details for LPC1767FBD100,551 by NXP Semiconductors

Overview of LPC1767FBD100,551 by NXP Semiconductors

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Price & Stock for LPC1767FBD100,551

Part # Distributor Description Stock Price Buy
DISTI # 70R5601
Newark Microcontroller Mcu, 32 Bit, Cortex-M3, 100Mhz, Lqfp-100, Product Range:Lpc1700 Arm Cortex-M3 Microcontrollers, Device Core:Arm Cortex-M3, Data Bus Width:32 Bit, Operating Frequency Max:100Mhz, Program Memory Size:512Kb Rohs Compliant: Yes |Nxp LPC1767FBD100,551 Min Qty: 90 Package Multiple: 1 Date Code: 0 Container: Bulk 0
  • 50 $10.5600
  • 100 $10.0000
  • 250 $8.7000
  • 500 $8.4500
$8.4500 / $10.5600 Buy Now
DISTI # 568-4967-ND
DigiKey IC MCU 32BIT 512KB FLASH 100LQFP Lead time: 13 Weeks Container: Tray Limited Supply - Call
Buy Now
Chip Stock   19858
RFQ
Flip Electronics Stock 459
RFQ

Part Details for LPC1767FBD100,551

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LPC1767FBD100,551 Part Data Attributes:

LPC1767FBD100,551 NXP Semiconductors
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LPC1767FBD100,551 NXP Semiconductors LPC1767FBD100 - 512kB flash, 64kB SRAM, Ethernet, no CAN, LQFP100 package QFP 100-Pin
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer NXP SEMICONDUCTORS
Part Package Code QFP
Package Description LQFP-100
Pin Count 100
Manufacturer Package Code SOT407-1
Reach Compliance Code compliant
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Samacsys Manufacturer NXP
Has ADC YES
Address Bus Width
Bit Size 32
Boundary Scan YES
CPU Family CORTEX-M3
Clock Frequency-Max 25 MHz
DAC Channels YES
DMA Channels YES
External Data Bus Width
Format FIXED POINT
Integrated Cache NO
JESD-30 Code S-PQFP-G100
JESD-609 Code e3
Length 14 mm
Low Power Mode YES
Moisture Sensitivity Level 3
Number of DMA Channels 8
Number of External Interrupts 4
Number of I/O Lines 70
Number of Terminals 100
Number of Timers 5
On Chip Data RAM Width 8
On Chip Program ROM Width 8
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
PWM Channels YES
Package Body Material PLASTIC/EPOXY
Package Code LFQFP
Package Equivalence Code QFP100,.63SQ,20
Package Shape SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
RAM (bytes) 65536
ROM (words) 524288
ROM Programmability FLASH
Seated Height-Max 1.6 mm
Speed 100 MHz
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3.3 V
Supply Voltage-Nom 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Tin (Sn)
Terminal Form GULL WING
Terminal Pitch 0.5 mm
Terminal Position QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 14 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC

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