Part Details for LPC1830FET256,551 by NXP Semiconductors
Overview of LPC1830FET256,551 by NXP Semiconductors
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
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Price & Stock for LPC1830FET256,551
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
24T8433
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Newark | Microcontroller Mcu, 32 Bit, Cortex-M3, 180Mhz, Lbga-256, Product Range:Lpc Family Lpc1800 Series Microcontrollers, Device Core:Arm Cortex-M3, Data Bus Width:32 Bit, Operating Frequency Max:180Mhz, Program Memory Size:- Rohs Compliant: Yes |Nxp LPC1830FET256,551 Min Qty: 90 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$10.3600 | Buy Now |
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DISTI #
568-6683-ND
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DigiKey | IC MCU 32BIT ROMLESS 256LBGA Lead time: 13 Weeks Container: Tray | Limited Supply - Call |
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Buy Now | |
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Future Electronics | LPC18xx Series 200 kB RAM 180 MHz SMT 32-Bit-Microcontroller - LBGA-256 RoHS: Compliant pbFree: Yes Min Qty: 180 Package Multiple: 90 Lead time: 13 Weeks Container: Tray | 0Tray |
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$7.8200 / $7.9500 | Buy Now |
Part Details for LPC1830FET256,551
LPC1830FET256,551 CAD Models
LPC1830FET256,551 Part Data Attributes:
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LPC1830FET256,551
NXP Semiconductors
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Datasheet
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LPC1830FET256,551
NXP Semiconductors
LPC1830FET256 - High Performance 32-bit Microcontroller based on ARM Cortex-M3 BGA 256-Pin
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Part Package Code | BGA | |
| Package Description | 17 X 17 MM, 1 MM HEIGHT, PLASTIC, MO-192, SOT740-2, LBGA-256 | |
| Pin Count | 256 | |
| Manufacturer Package Code | SOT740-2 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Samacsys Manufacturer | NXP | |
| Has ADC | YES | |
| Address Bus Width | 24 | |
| Bit Size | 32 | |
| CPU Family | CORTEX-M3 | |
| Clock Frequency-Max | 25 MHz | |
| DAC Channels | YES | |
| DMA Channels | YES | |
| External Data Bus Width | 32 | |
| JESD-30 Code | S-PBGA-B256 | |
| JESD-609 Code | e1 | |
| Length | 17 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of I/O Lines | 164 | |
| Number of Terminals | 256 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| RAM (bytes) | 204800 | |
| ROM (words) | 65536 | |
| ROM Programmability | FLASH | |
| Seated Height-Max | 1.55 mm | |
| Speed | 180 MHz | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3.3 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 17 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |