There are no models available for this part yet.
Overview of LPC1850FET180,551 by NXP Semiconductors
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 8 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Education and Research
Aerospace and Defense
Agriculture Technology
Robotics and Drones
Price & Stock for LPC1850FET180,551 by NXP Semiconductors
| Part # | Manufacturer | Description | Stock | Price | Buy | ||
|---|---|---|---|---|---|---|---|
|
DISTI #
78T6058
|
Newark | Quad Spi Flash Interface (Spifi), 200 Kb Sram, Two High-Speed Usb, Ethernet, Lcd, Tfbga180 Package/ Tray Rohs Compliant: Yes |Nxp LPC1850FET180,551 RoHS: Compliant Min Qty: 189 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
|
$7.3100 / $9.0300 | Buy Now | |
|
DISTI #
LPC1850FET180,551-ND
|
DigiKey | IC MCU 32BIT ROMLESS 180TFBGA Min Qty: 189 Lead time: 13 Weeks Container: Tray | Temporarily Out of Stock |
|
$7.3897 | Buy Now | |
|
DISTI #
LPC1850FET180,551
|
Avnet Americas | MCU 32-bit LPC1800 ARM Cortex M3 RISC ROMLess 2.5V/3.3V 180-Pin TFBGA Tray - Trays (Alt: LPC1850FET180,551) RoHS: Compliant Min Qty: 189 Package Multiple: 189 Lead time: 13 Weeks, 0 Days Container: Tray | 0 |
|
$7.2265 | Buy Now | |
|
DISTI #
771-LPC1850FET180551
|
Mouser Electronics | ARM Microcontrollers - MCU Cortex-M3 200kB SRAM 200 kB SRAM RoHS: Compliant | 189 |
|
$7.3800 / $13.1200 | Buy Now | |
| Future Electronics | LPC18xx Series 1 MB Flash 200 kB RAM 180 MHz 32-Bit-Microcontroller - TFBGA-180 RoHS: Compliant pbFree: Yes Min Qty: 189 Package Multiple: 189 Lead time: 13 Weeks Container: Tray | 0Tray |
|
$7.0900 / $7.1600 | Buy Now | ||
|
DISTI #
LPC1850FET180,551
|
Avnet Silica | MCU 32-bit LPC1800 ARM Cortex M3 RISC ROMLess 2.5V/3.3V 180-Pin TFBGA Tray (Alt: LPC1850FET180,551) RoHS: Compliant Min Qty: 189 Package Multiple: 189 Lead time: 15 Weeks, 0 Days | Silica - 0 |
|
Buy Now | ||
|
DISTI #
LPC1850FET180,551
|
EBV Elektronik | MCU 32-bit LPC1800 ARM Cortex M3 RISC ROMLess 2.5V/3.3V 180-Pin TFBGA Tray (Alt: LPC1850FET180,551) RoHS: Compliant Min Qty: 189 Package Multiple: 189 Lead time: 15 Weeks, 0 Days | EBV - 0 |
|
Buy Now | ||
| Flip Electronics | Stock, ship today | 30 |
|
RFQ |
CAD Models for LPC1850FET180,551 by NXP Semiconductors
Part Data Attributes for LPC1850FET180,551 by NXP Semiconductors
|
|
|
|---|---|
|
Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
Active
|
|
Ihs Manufacturer
|
NXP SEMICONDUCTORS
|
|
Part Package Code
|
BGA
|
|
Package Description
|
SOT570-3, TFBGA-180
|
|
Pin Count
|
180
|
|
Manufacturer Package Code
|
SOT570-3
|
|
Reach Compliance Code
|
compliant
|
|
ECCN Code
|
3A991.A.2
|
|
HTS Code
|
8542.31.00.01
|
|
Factory Lead Time
|
13 Weeks
|
|
Samacsys Manufacturer
|
NXP
|
|
Has ADC
|
YES
|
|
Address Bus Width
|
24
|
|
Bit Size
|
32
|
|
CPU Family
|
CORTEX-M3
|
|
Clock Frequency-Max
|
25 MHz
|
|
DAC Channels
|
YES
|
|
DMA Channels
|
YES
|
|
External Data Bus Width
|
32
|
|
JESD-30 Code
|
S-PBGA-B180
|
|
JESD-609 Code
|
e1
|
|
Length
|
12 mm
|
|
Moisture Sensitivity Level
|
3
|
|
Number of I/O Lines
|
118
|
|
Number of Terminals
|
180
|
|
On Chip Program ROM Width
|
8
|
|
Operating Temperature-Max
|
85 °C
|
|
Operating Temperature-Min
|
-40 °C
|
|
PWM Channels
|
YES
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
TFBGA
|
|
Package Equivalence Code
|
BGA180,14X14,32
|
|
Package Shape
|
SQUARE
|
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Package Style
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GRID ARRAY, THIN PROFILE, FINE PITCH
|
|
Peak Reflow Temperature (Cel)
|
260
|
|
Qualification Status
|
Not Qualified
|
|
RAM (bytes)
|
204800
|
|
ROM (words)
|
65536
|
|
ROM Programmability
|
FLASH
|
|
Seated Height-Max
|
1.2 mm
|
|
Speed
|
180 MHz
|
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Supply Voltage-Max
|
3.6 V
|
|
Supply Voltage-Min
|
3.3 V
|
|
Supply Voltage-Nom
|
3.3 V
|
|
Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
INDUSTRIAL
|
|
Terminal Finish
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
|
Terminal Form
|
BALL
|
|
Terminal Pitch
|
0.8 mm
|
|
Terminal Position
|
BOTTOM
|
|
Time@Peak Reflow Temperature-Max (s)
|
30
|
|
Width
|
12 mm
|
|
uPs/uCs/Peripheral ICs Type
|
MICROCONTROLLER, RISC
|