Part Details for LPC4078FBD80 by NXP Semiconductors
Overview of LPC4078FBD80 by NXP Semiconductors
- Distributor Offerings:
- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
- Reference Designs:
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part Details for LPC4078FBD80
LPC4078FBD80 CAD Models
LPC4078FBD80 Part Data Attributes
|
|
LPC4078FBD80
NXP Semiconductors
Buy Now
Datasheet
|
Compare Parts:
LPC4078FBD80
NXP Semiconductors
RISC MICROCONTROLLER
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | LQFP-80 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Samacsys Manufacturer | NXP | |
| Has ADC | YES | |
| Address Bus Width | ||
| Bit Size | 32 | |
| Clock Frequency-Max | 25 MHz | |
| DAC Channels | YES | |
| DMA Channels | YES | |
| External Data Bus Width | ||
| JESD-30 Code | S-PQFP-G80 | |
| JESD-609 Code | e3 | |
| Length | 12 mm | |
| Moisture Sensitivity Level | 2 | |
| Number of Terminals | 80 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFQFP | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| ROM Programmability | FLASH | |
| Seated Height-Max | 1.6 mm | |
| Speed | 120 MHz | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 2.4 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 12 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |