There are no models available for this part yet.
Overview of LPC4327JET100 by NXP Semiconductors
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 2 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Price & Stock for LPC4327JET100 by NXP Semiconductors
| Part # | Manufacturer | Description | Stock | Price | Buy | ||
|---|---|---|---|---|---|---|---|
|
DISTI #
LPC4327JET100
|
Avnet Americas | - Trays (Alt: LPC4327JET100) RoHS: Compliant Min Qty: 59 Package Multiple: 1 Lead time: 0 Weeks, 2 Days Container: Tray | 1040 Partner Stock |
|
RFQ | ||
| Flip Electronics | Stock, ship today | 1040 |
|
RFQ |
CAD Models for LPC4327JET100 by NXP Semiconductors
Part Data Attributes for LPC4327JET100 by NXP Semiconductors
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|---|---|
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Rohs Code
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Yes
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Part Life Cycle Code
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Active
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Ihs Manufacturer
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NXP SEMICONDUCTORS
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Package Description
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9 X 9 MM, 0.70 MM HEIGHT, PLASTIC, SOT926-1, TFBGA-100
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Reach Compliance Code
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compliant
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ECCN Code
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3A991.A.2
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HTS Code
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8542.31.00.01
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Factory Lead Time
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2 Days
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Has ADC
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YES
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Address Bus Width
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Bit Size
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32
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Clock Frequency-Max
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25 MHz
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DAC Channels
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YES
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DMA Channels
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YES
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External Data Bus Width
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JESD-30 Code
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S-PBGA-B100
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Length
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9 mm
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Moisture Sensitivity Level
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3
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Number of I/O Lines
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49
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Number of Terminals
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100
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Operating Temperature-Max
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105 °C
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Operating Temperature-Min
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-40 °C
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PWM Channels
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NO
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Package Body Material
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PLASTIC/EPOXY
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Package Code
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TFBGA
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Package Shape
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SQUARE
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Package Style
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GRID ARRAY, THIN PROFILE, FINE PITCH
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Peak Reflow Temperature (Cel)
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260
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ROM Programmability
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FLASH
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Seated Height-Max
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1.2 mm
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Speed
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204 MHz
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Supply Voltage-Max
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3.6 V
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Supply Voltage-Min
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2.2 V
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Supply Voltage-Nom
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3.3 V
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Surface Mount
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YES
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Technology
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CMOS
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Temperature Grade
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INDUSTRIAL
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Terminal Form
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BALL
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Terminal Pitch
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0.8 mm
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Terminal Position
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BOTTOM
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Time@Peak Reflow Temperature-Max (s)
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NOT SPECIFIED
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Width
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9 mm
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uPs/uCs/Peripheral ICs Type
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MICROCONTROLLER, RISC
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