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Part Details for LPC4330FET100,551 by NXP Semiconductors
Overview of LPC4330FET100,551 by NXP Semiconductors
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- Number of FFF Equivalents:
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- Number of Functional Equivalents:
- Part Data Attributes
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Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for LPC4330FET100,551
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
78T6063
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Newark | Lpc4330Fet100/Tray Rohs Compliant: Yes |Nxp LPC4330FET100,551 Min Qty: 260 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$6.8300 / $7.0300 | Buy Now |
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DISTI #
568-9451-ND
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DigiKey | IC MCU 32BIT ROMLESS 100TFBGA Min Qty: 1 Lead time: 13 Weeks Container: Tray | Temporarily Out of Stock |
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$7.7561 / $12.2500 | Buy Now |
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DISTI #
LPC4330FET100,551
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Avnet Americas | MCU 32-bit LPC4300 ARM Cortex M4 RISC ROMLess 2.5V/3.3V 100-Pin TF-BGA Tray - Trays (Alt: LPC4330FET100,551) RoHS: Compliant Min Qty: 260 Package Multiple: 1 Lead time: 13 Weeks, 0 Days Container: Tray | 0 |
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$6.2258 / $7.1797 | Buy Now |
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DISTI #
771-LPC4330FET100551
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Mouser Electronics | ARM Microcontrollers - MCU Dual-core Cortex-M4/ M0, 264kB SRAM RoHS: Compliant | 84 |
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$7.0600 / $11.6300 | Buy Now |
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Future Electronics | LPC43xx Series 264 kB RAM 204 MHz SMT 32-Bit Microcontroller - TFBGA-100 RoHS: Compliant pbFree: Yes Min Qty: 260 Package Multiple: 260 Container: Tray | 0Tray |
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$6.9000 | Buy Now |
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DISTI #
LPC4330FET100,551
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Avnet Americas | MCU 32-bit LPC4300 ARM Cortex M4 RISC ROMLess 2.5V/3.3V 100-Pin TF-BGA Tray - Trays (Alt: LPC4330FET100,551) RoHS: Compliant Min Qty: 260 Package Multiple: 1 Lead time: 13 Weeks, 0 Days Container: Tray | 134 |
|
$6.2258 / $7.1797 | Buy Now |
|
DISTI #
LPC4330FET100,551
|
Avnet Americas | MCU 32-bit LPC4300 ARM Cortex M4 RISC ROMLess 2.5V/3.3V 100-Pin TF-BGA Tray - Trays (Alt: LPC4330FET100,551) RoHS: Compliant Min Qty: 260 Package Multiple: 1 Lead time: 13 Weeks, 0 Days Container: Tray | 0 |
|
$6.2258 / $7.1797 | Buy Now |
|
DISTI #
LPC4330FET100,551
|
Avnet Americas | MCU 32-bit LPC4300 ARM Cortex M4 RISC ROMLess 2.5V/3.3V 100-Pin TF-BGA Tray - Trays (Alt: LPC4330FET100,551) RoHS: Compliant Min Qty: 260 Package Multiple: 1 Lead time: 13 Weeks, 0 Days Container: Tray | 134 |
|
$6.2258 / $7.1797 | Buy Now |
|
DISTI #
LPC4330FET100,551
|
Avnet Americas | MCU 32-bit LPC4300 ARM Cortex M4 RISC ROMLess 2.5V/3.3V 100-Pin TF-BGA Tray - Trays (Alt: LPC4330FET100,551) RoHS: Compliant Min Qty: 260 Package Multiple: 1 Lead time: 13 Weeks, 0 Days Container: Tray | 0 |
|
$6.2258 / $7.1797 | Buy Now |
|
DISTI #
LPC4330FET100,551
|
Avnet Silica | MCU 32-bit LPC4300 ARM Cortex M4 RISC ROMLess 2.5V/3.3V 100-Pin TF-BGA Tray (Alt: LPC4330FET100,551) RoHS: Compliant Min Qty: 260 Package Multiple: 260 Lead time: 2 Weeks, 1 Days | Silica - 0 |
|
Buy Now |
Part Details for LPC4330FET100,551
LPC4330FET100,551 CAD Models
LPC4330FET100,551 Part Data Attributes
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LPC4330FET100,551
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
LPC4330FET100,551
NXP Semiconductors
LPC4330FET100 - Dual-core Cortex-M4/M0, 264 kB SRAM, 2 HS USB with on-chip PHY, Ethernet, CAN, AES, SPIFI, SGPIO, SCT BGA 100-Pin
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Part Package Code | BGA | |
| Package Description | 9 X 9 MM, 0.70 MM HEIGHT, PLASTIC, SOT926-1, TFBGA-100 | |
| Pin Count | 100 | |
| Manufacturer Package Code | SOT926-1 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 13 Weeks | |
| Samacsys Manufacturer | NXP | |
| Has ADC | YES | |
| Address Bus Width | 24 | |
| Bit Size | 32 | |
| CPU Family | CORTEX-M4 | |
| Clock Frequency-Max | 25 MHz | |
| DAC Channels | YES | |
| DMA Channels | YES | |
| External Data Bus Width | 32 | |
| JESD-30 Code | S-PBGA-B100 | |
| JESD-609 Code | e1 | |
| Length | 9 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of I/O Lines | 49 | |
| Number of Terminals | 100 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | NO | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA100,10X10,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| RAM (bytes) | 270336 | |
| ROM Programmability | FLASH | |
| Seated Height-Max | 1.2 mm | |
| Speed | 180 MHz | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 2.2 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 9 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |