Part Details for LS1043ASE7MNLA by NXP Semiconductors
Overview of LS1043ASE7MNLA by NXP Semiconductors
- Distributor Offerings: (6 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Industrial Automation
Agriculture Technology
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Electronic Manufacturing
Robotics and Drones
Price & Stock for LS1043ASE7MNLA
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
01AC9146
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Newark | Layerscape 64-Bit Arm Cortex-A53, Quad-Core, 1.2Ghz, 0 To 105C, Security Enabled, 21X21 Pkg, Low Power/ Tray Rohs Compliant: Yes |Nxp LS1043ASE7MNLA RoHS: Compliant Min Qty: 60 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$85.7100 / $91.0700 | Buy Now |
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DISTI #
LS1043ASE7MNLA-ND
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DigiKey | IC MPU QORIQ 1.2GHZ 621FCPBGA Min Qty: 60 Lead time: 18 Weeks Container: Tray | Temporarily Out of Stock |
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$83.6970 | Buy Now |
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DISTI #
LS1043ASE7MNLA
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Avnet Americas | MCU 32-Bit LS10 ARM Cortex A53 RISC ROMLess 0.9V 621-Pin FCPBGA - Trays (Alt: LS1043ASE7MNLA) RoHS: Compliant Min Qty: 60 Package Multiple: 60 Lead time: 18 Weeks, 0 Days Container: Tray | 0 |
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$74.3973 | Buy Now |
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DISTI #
841-LS1043ASE7MNLA
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Mouser Electronics | Microprocessors - MPU Layerscape 64-bit Arm Cortex-A53, Quad-core, 1.2GHz, 0 to 105C, Security enabled, 21x21 pkg, Low power RoHS: Compliant | 0 |
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$96.9600 | Order Now |
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Future Electronics | RoHS: Compliant pbFree: Yes Min Qty: 60 Package Multiple: 60 Lead time: 18 Weeks Container: Tray | 0Tray |
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$83.7000 | Buy Now |
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Flip Electronics | Stock | 30 |
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RFQ |
Part Details for LS1043ASE7MNLA
LS1043ASE7MNLA CAD Models
LS1043ASE7MNLA Part Data Attributes
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LS1043ASE7MNLA
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
LS1043ASE7MNLA
NXP Semiconductors
32-BIT, 1200MHz, RISC PROCESSOR, PBGA621
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | HFBGA, BGA621,25X25,32 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002.A.1 | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 18 Weeks | |
| Date Of Intro | 2016-09-06 | |
| Samacsys Manufacturer | NXP | |
| JESD-30 Code | S-PBGA-B621 | |
| JESD-609 Code | e1 | |
| Length | 21 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 621 | |
| Operating Temperature-Max | 105 °C | |
| Operating Temperature-Min | ||
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Equivalence Code | BGA621,25X25,25 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 250 | |
| Seated Height-Max | 2.07 mm | |
| Supply Voltage-Max | 0.93 V | |
| Supply Voltage-Min | 0.87 V | |
| Supply Voltage-Nom | 0.9 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 21 mm | |
| uPs/uCs/Peripheral ICs Type | SoC |