Part Details for LS1043ASN8QQA by NXP Semiconductors
Overview of LS1043ASN8QQA by NXP Semiconductors
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Industrial Automation
Agriculture Technology
Renewable Energy
Electronic Manufacturing
Robotics and Drones
Price & Stock for LS1043ASN8QQA
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
LS1043ASN8QQA
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Avnet Americas | MCU 32-Bit LS10 ARM Cortex A53 RISC ROMLess 0.9V 780-Pin FCPBGA - Trays (Alt: LS1043ASN8QQA) RoHS: Compliant Min Qty: 60 Package Multiple: 60 Lead time: 18 Weeks, 0 Days Container: Tray | 0 |
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RFQ |
Part Details for LS1043ASN8QQA
LS1043ASN8QQA CAD Models
LS1043ASN8QQA Part Data Attributes
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LS1043ASN8QQA
NXP Semiconductors
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Datasheet
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LS1043ASN8QQA
NXP Semiconductors
32-BIT, 1600MHz, RISC PROCESSOR, PBGA780
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | HBGA, | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 18 Weeks | |
| Date Of Intro | 2016-09-06 | |
| Address Bus Width | 16 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 100 MHz | |
| External Data Bus Width | 32 | |
| Format | FIXED POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B780 | |
| JESD-609 Code | e1 | |
| Length | 23 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 780 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Peak Reflow Temperature (Cel) | 250 | |
| Seated Height-Max | 2.07 mm | |
| Speed | 1600 MHz | |
| Supply Voltage-Max | 1.03 V | |
| Supply Voltage-Min | 0.97 V | |
| Supply Voltage-Nom | 1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 23 mm | |
| uPs/uCs/Peripheral ICs Type | SoC |