Datasheets
M2716F1 by:

UVPROM, 2KX8, 450ns, NMOS, CDIP24, WINDOWED, CERAMIC, DIP-24

Part Details for M2716F1 by Atmel Corporation

Overview of M2716F1 by Atmel Corporation

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Applications Industrial Automation Computing and Data Storage Financial Technology (Fintech) Healthcare Telecommunications

Part Details for M2716F1

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M2716F1 Part Data Attributes

M2716F1 Atmel Corporation
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M2716F1 Atmel Corporation UVPROM, 2KX8, 450ns, NMOS, CDIP24, WINDOWED, CERAMIC, DIP-24
Part Life Cycle Code Obsolete
Ihs Manufacturer ATMEL CORP
Part Package Code DIP
Package Description WINDOWED, CERAMIC, DIP-24
Pin Count 24
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.61
Access Time-Max 450 ns
JESD-30 Code R-GDIP-T24
Length 31.75 mm
Memory Density 16384 bit
Memory IC Type UVPROM
Memory Width 8
Number of Functions 1
Number of Terminals 24
Number of Words 2048 words
Number of Words Code 2000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 2KX8
Package Body Material CERAMIC, GLASS-SEALED
Package Code WDIP
Package Shape RECTANGULAR
Package Style IN-LINE, WINDOW
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 5.715 mm
Supply Current-Max 0.025 mA
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology NMOS
Temperature Grade COMMERCIAL
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for M2716F1

This table gives cross-reference parts and alternative options found for M2716F1. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M2716F1, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
NMC27C16H-45 2KX8 UVPROM, 450ns, CDIP24, WINDOWED, CERDIP-24 Texas Instruments M2716F1 vs NMC27C16H-45
I2716 UVPROM, 2KX8, 450ns, MOS, CDIP24, CERDIP-24 Intel Corporation M2716F1 vs I2716
AM2716B-455DI UVPROM, 2KX8, 450ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 AMD M2716F1 vs AM2716B-455DI
MBM2716 UVPROM Card, 2KX8, 450ns, NMOS, CDIP24, CERAMIC, DIP-24 FUJITSU Semiconductor Limited M2716F1 vs MBM2716
ID2716 UVPROM, 2KX8, 450ns, MOS, CDIP24, CERDIP-24 Intel Corporation M2716F1 vs ID2716
7802201JA UVPROM, 2KX8, 450ns, NMOS, CDIP24, CERAMIC, DIP-24 Rochester Electronics LLC M2716F1 vs 7802201JA
M2716F1 UVPROM, 2KX8, 450ns, NMOS, CDIP24, CERAMIC, DIP-24 Thales Group M2716F1 vs M2716F1
MD2716/B UVPROM, Rochester Electronics LLC M2716F1 vs MD2716/B
MD2716 UVPROM, Rochester Electronics LLC M2716F1 vs MD2716
AM2716DC UVPROM, 2KX8, 450ns, MOS, CDIP24, HERMETIC SEALED, WINDOWED, DIP-24 AMD M2716F1 vs AM2716DC
Part Number Description Manufacturer Compare
M2716 UVPROM, 2KX8, 450ns, CMOS, PDIP24, DIP-24 Intel Corporation M2716F1 vs M2716
Q2716 UVPROM, 2KX8, 450ns, MOS, CDIP24, CERDIP-24 Intel Corporation M2716F1 vs Q2716
AM2716-6DC UVPROM, 2KX8, 450ns, MOS, CDIP24, HERMETIC SEALED, WINDOWED, DIP-24 AMD M2716F1 vs AM2716-6DC
AM2716B-450DC UVPROM, 2KX8, 450ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 AMD M2716F1 vs AM2716B-450DC
ET2716Q UVPROM, 2KX8, 450ns, NMOS, CDIP24, CERAMIC, DIP-24 Teledyne e2v M2716F1 vs ET2716Q
27C16Q450/883 IC 2K X 8 UVPROM, 450 ns, CDIP24, WINDOWED, CERAMIC, DIP-24, Programmable ROM National Semiconductor Corporation M2716F1 vs 27C16Q450/883
AM2716B-455DC UVPROM, 2KX8, 450ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 AMD M2716F1 vs AM2716B-455DC
7802201JA UVPROM, 2KX8, 450ns, NMOS, CDIP24, CERAMIC, DIP-24 Defense Logistics Agency M2716F1 vs 7802201JA
NMC27C16E-45 2KX8 UVPROM, 450ns, CDIP24, WINDOWED, CERAMIC, DIP-24 Texas Instruments M2716F1 vs NMC27C16E-45
NMC27C16H-45 2KX8 UVPROM, 450ns, CDIP24, WINDOWED, CERDIP-24 Texas Instruments M2716F1 vs NMC27C16H-45

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