Datasheets
M2716F1 by:

2KX8 UVPROM, 450ns, CDIP24, WINDOWED, FRIT SEALED, CERAMIC, DIP-24

Part Details for M2716F1 by STMicroelectronics

Overview of M2716F1 by STMicroelectronics

Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.

Applications Industrial Automation Computing and Data Storage Financial Technology (Fintech) Healthcare Telecommunications

Price & Stock for M2716F1

Part # Distributor Description Stock Price Buy
Bristol Electronics   21
RFQ
Bristol Electronics   16
RFQ
Quest Components EPROM, 2K x 8, 24 Pin, Ceramic, DIP 60
  • 1 $15.7500
  • 6 $14.0000
  • 19 $12.9500
$12.9500 / $15.7500 Buy Now
Quest Components EPROM, 2K x 8, 24 Pin, Ceramic, DIP 16
  • 1 $12.0000
  • 4 $8.8000
  • 10 $8.0000
$8.0000 / $12.0000 Buy Now
Quest Components EPROM, 2K x 8, 24 Pin, Ceramic, DIP 10
  • 1 $14.0000
  • 5 $10.5000
$10.5000 / $14.0000 Buy Now
Quest Components EPROM, 2K x 8, 24 Pin, Ceramic, DIP 8
  • 1 $15.7500
  • 3 $14.7000
  • 6 $14.0000
$14.0000 / $15.7500 Buy Now

Part Details for M2716F1

M2716F1 CAD Models

M2716F1 Part Data Attributes

M2716F1 STMicroelectronics
Buy Now Datasheet
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M2716F1 STMicroelectronics 2KX8 UVPROM, 450ns, CDIP24, WINDOWED, FRIT SEALED, CERAMIC, DIP-24
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer STMICROELECTRONICS
Part Package Code DIP
Package Description WINDOWED, FRIT SEALED, CERAMIC, DIP-24
Pin Count 24
Reach Compliance Code not_compliant
ECCN Code EAR99
HTS Code 8542.32.00.61
Samacsys Manufacturer STMicroelectronics
Access Time-Max 450 ns
Additional Feature 25V PROGRAMMING VOLTAGE
I/O Type COMMON
JESD-30 Code R-GDIP-T24
JESD-609 Code e0
Length 31.75 mm
Memory Density 16384 bit
Memory IC Type UVPROM
Memory Width 8
Number of Functions 1
Number of Terminals 24
Number of Words 2048 words
Number of Words Code 2000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 2KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED
Package Code DIP
Package Equivalence Code DIP24,.6
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Programming Voltage 25 V
Qualification Status Not Qualified
Seated Height-Max 5.715 mm
Supply Current-Max 0.1 mA
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology NMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for M2716F1

This table gives cross-reference parts and alternative options found for M2716F1. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M2716F1, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
M2716 UVPROM, 2KX8, 450ns, CMOS, PDIP24, DIP-24 Intel Corporation M2716F1 vs M2716
ET2716Q UVPROM, 2KX8, 450ns, NMOS, CDIP24, CERAMIC, DIP-24 Thales Group M2716F1 vs ET2716Q
AM2716-6DC UVPROM, 2KX8, 450ns, MOS, CDIP24, HERMETIC SEALED, WINDOWED, DIP-24 AMD M2716F1 vs AM2716-6DC
I2716 UVPROM, 2KX8, 450ns, MOS, CDIP24, CERDIP-24 Intel Corporation M2716F1 vs I2716
ET2716Q UVPROM, 2KX8, 450ns, NMOS, CDIP24, CERAMIC, DIP-24 Teledyne e2v M2716F1 vs ET2716Q
27C16Q450/883 2KX8 UVPROM, 450ns, CDIP24, WINDOWED, CERAMIC, DIP-24 Texas Instruments M2716F1 vs 27C16Q450/883
NMC27C16H-45 2KX8 UVPROM, 450ns, CDIP24, WINDOWED, CERDIP-24 Texas Instruments M2716F1 vs NMC27C16H-45
MD2716/B UVPROM, Rochester Electronics LLC M2716F1 vs MD2716/B
MD2716M/B UVPROM, 2KX8, 450ns, MOS, CDIP24, Intel Corporation M2716F1 vs MD2716M/B
MBM2716 UVPROM Card, 2KX8, 450ns, NMOS, CDIP24, CERAMIC, DIP-24 FUJITSU Semiconductor Limited M2716F1 vs MBM2716
Part Number Description Manufacturer Compare
27C16Q450/883 2KX8 UVPROM, 450ns, CDIP24, WINDOWED, CERAMIC, DIP-24 Texas Instruments M2716F1 vs 27C16Q450/883
NMC27C16H-45 2KX8 UVPROM, 450ns, CDIP24, WINDOWED, CERDIP-24 Texas Instruments M2716F1 vs NMC27C16H-45
ET2716Q UVPROM, 2KX8, 450ns, NMOS, CDIP24, CERAMIC, DIP-24 Teledyne e2v M2716F1 vs ET2716Q
I2716 UVPROM, 2KX8, 450ns, MOS, CDIP24, CERDIP-24 Intel Corporation M2716F1 vs I2716
AM2716B-450DC UVPROM, 2KX8, 450ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 AMD M2716F1 vs AM2716B-450DC
ID2716 UVPROM, 2KX8, 450ns, MOS, CDIP24, CERDIP-24 Intel Corporation M2716F1 vs ID2716
M2716 UVPROM, 2KX8, 450ns, CMOS, PDIP24, DIP-24 Intel Corporation M2716F1 vs M2716
MD2716/B UVPROM, Rochester Electronics LLC M2716F1 vs MD2716/B
AM2716B-455DC UVPROM, 2KX8, 450ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 AMD M2716F1 vs AM2716B-455DC
7802201JA UVPROM, 2KX8, 450ns, NMOS, CDIP24, CERAMIC, DIP-24 Defense Logistics Agency M2716F1 vs 7802201JA

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