Part Details for M27C256B-15XF1 by STMicroelectronics
Overview of M27C256B-15XF1 by STMicroelectronics
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- Number of FFF Equivalents:
- CAD Models:
- Number of Functional Equivalents:
- Part Data Attributes
- Reference Designs:
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Price & Stock for M27C256B-15XF1
| Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 23 |
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RFQ | ||
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Bristol Electronics | Min Qty: 1 | 43 |
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$5.4844 / $8.7750 | Buy Now |
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Bristol Electronics | 10 |
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RFQ | ||
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Quest Components | EPROM, 32K x 8, 28 Pin, Ceramic, DIP | 448 |
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$4.4000 / $12.0000 | Buy Now |
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Quest Components | EPROM, 32K x 8, 28 Pin, Ceramic, DIP | 69 |
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$7.4000 / $12.0000 | Buy Now |
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Quest Components | EPROM, 32K x 8, 28 Pin, Ceramic, DIP | 34 |
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$7.8975 / $11.7000 | Buy Now |
Part Details for M27C256B-15XF1
M27C256B-15XF1 CAD Models
M27C256B-15XF1 Part Data Attributes
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M27C256B-15XF1
STMicroelectronics
Buy Now
Datasheet
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M27C256B-15XF1
STMicroelectronics
32KX8 UVPROM, 150ns, CDIP28, 0.280 INCH, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-28
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | STMICROELECTRONICS | |
| Part Package Code | DIP | |
| Package Description | 0.280 INCH, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-28 | |
| Pin Count | 28 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 150 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-CDIP-T28 | |
| JESD-609 Code | e3 | |
| Length | 36.92 mm | |
| Memory Density | 262144 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 28 | |
| Number of Words | 32768 words | |
| Number of Words Code | 32000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 32KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | WDIP | |
| Package Equivalence Code | DIP28,.6 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE, WINDOW | |
| Parallel/Serial | PARALLEL | |
| Programming Voltage | 12.75 V | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.72 mm | |
| Standby Current-Max | 0.0002 A | |
| Supply Current-Max | 0.03 mA | |
| Supply Voltage-Max (Vsup) | 5.25 V | |
| Supply Voltage-Min (Vsup) | 4.75 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 15.24 mm |
Alternate Parts for M27C256B-15XF1
This table gives cross-reference parts and alternative options found for M27C256B-15XF1. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M27C256B-15XF1, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| AM27C256-155DC | UVPROM, 32KX8, 150ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | M27C256B-15XF1 vs AM27C256-155DC |
| TC57256AD-150 | IC 32K X 8 UVPROM, 150 ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28, Programmable ROM | Toshiba America Electronic Components | M27C256B-15XF1 vs TC57256AD-150 |
| M27C256B-25XF1X | 32KX8 UVPROM, 150ns, CDIP28, FRIT SEALED, WINDOWED, CERAMIC, DIP-28 | STMicroelectronics | M27C256B-15XF1 vs M27C256B-25XF1X |
| CY27C256A-150WC | UVPROM, 32KX8, 150ns, CMOS, CDIP28, 0.600 INCH, HERMETIC SEALED, WINDOWED, CERDIP-28 | Rochester Electronics LLC | M27C256B-15XF1 vs CY27C256A-150WC |
| 27C256-15/J | 32K X 8 UVPROM, 150 ns, CDIP28, 0.600 INCH, CERDIP-28 | Microchip Technology Inc | M27C256B-15XF1 vs 27C256-15/J |
| M87C257-20F1 | 32KX8 UVPROM, 150ns, CDIP28, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-28 | STMicroelectronics | M27C256B-15XF1 vs M87C257-20F1 |
| M27C256B-20F1E | 32KX8 UVPROM, 150ns, CDIP28, 0.280 INC, ROHS COMPLIANT, CERAMIC, WINDOWED, FRIT SEALED, DIP-28 | STMicroelectronics | M27C256B-15XF1 vs M27C256B-20F1E |
| M27C256B-25F6 | 32KX8 UVPROM, 150ns, CDIP28, 0.280 INCH, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-28 | STMicroelectronics | M27C256B-15XF1 vs M27C256B-25F6 |
| SMJ27C256-15J | 32KX8 UVPROM, 150ns, CDIP28, 0.600 INCH, SIDE BRAZED, WINDOWED, CERAMIC, DIP-28 | Texas Instruments | M27C256B-15XF1 vs SMJ27C256-15J |
| M27C256B-15XF7X | 32KX8 UVPROM, 150ns, CDIP28, FRIT SEALED, WINDOWED, CERAMIC, DIP-28 | STMicroelectronics | M27C256B-15XF1 vs M27C256B-15XF7X |