Datasheets
M27C801-100F6 by: STMicroelectronics

1MX8 UVPROM, 100ns, CDIP32, ROHS COMPLIANT, CERAMIC, WINDOWED, FRIT SEALED, DIP-32

Part Details for M27C801-100F6 by STMicroelectronics

Overview of M27C801-100F6 by STMicroelectronics

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Applications Consumer Electronics Industrial Automation

Price & Stock for M27C801-100F6

Part # Distributor Description Stock Price Buy
Bristol Electronics   6
RFQ

Part Details for M27C801-100F6

M27C801-100F6 CAD Models

M27C801-100F6 Part Data Attributes

M27C801-100F6 STMicroelectronics
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M27C801-100F6 STMicroelectronics 1MX8 UVPROM, 100ns, CDIP32, ROHS COMPLIANT, CERAMIC, WINDOWED, FRIT SEALED, DIP-32
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer STMICROELECTRONICS
Part Package Code DIP
Package Description ROHS COMPLIANT, CERAMIC, WINDOWED, FRIT SEALED, DIP-32
Pin Count 32
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.61
Samacsys Manufacturer STMicroelectronics
Access Time-Max 100 ns
I/O Type COMMON
JESD-30 Code R-CDIP-T32
JESD-609 Code e3
Length 41.885 mm
Memory Density 8388608 bit
Memory IC Type UVPROM
Memory Width 8
Number of Functions 1
Number of Terminals 32
Number of Words 1048576 words
Number of Words Code 1000000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 1MX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code WDIP
Package Equivalence Code DIP32,.6
Package Shape RECTANGULAR
Package Style IN-LINE, WINDOW
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 5.72 mm
Standby Current-Max 0.0001 A
Supply Current-Max 0.035 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish MATTE TIN
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for M27C801-100F6

This table gives cross-reference parts and alternative options found for M27C801-100F6. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M27C801-100F6, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
M27C801-150F6 1MX8 UVPROM, 150ns, CDIP32, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-32 STMicroelectronics M27C801-100F6 vs M27C801-150F6
AM27C080-100DI UVPROM, 1MX8, 100ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 AMD M27C801-100F6 vs AM27C080-100DI
Part Number Description Manufacturer Compare
AM27C080-200DIB UVPROM, 1MX8, 200ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 AMD M27C801-100F6 vs AM27C080-200DIB
M27C801-150B6 1MX8 OTPROM, 150ns, PDIP32, 0.600 INCH, LEAD FREE, PLASTIC, DIP-32 STMicroelectronics M27C801-100F6 vs M27C801-150B6
M27W801-200F6 1MX8 UVPROM, 120ns, CDIP32, CERAMIC, WINDOWED, FRIT SEALED, DIP-32 STMicroelectronics M27C801-100F6 vs M27W801-200F6
M27W801-150B6 1MX8 OTPROM, 120ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 STMicroelectronics M27C801-100F6 vs M27W801-150B6
AT27C080-12DC UVPROM, 1MX8, 120ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, CERDIP-32 Atmel Corporation M27C801-100F6 vs AT27C080-12DC
AM27C080-105DI UVPROM, 1MX8, 100ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 AMD M27C801-100F6 vs AM27C080-105DI
KM23C8000D-12 MASK ROM, 1MX8, 120ns, CMOS, PDIP32, 0.600 INCH, DIP-32 Samsung Semiconductor M27C801-100F6 vs KM23C8000D-12
KM23C8000A-20 MASK ROM, 1MX8, 200ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Samsung Semiconductor M27C801-100F6 vs KM23C8000A-20
M27C801-80B6 1MX8 OTPROM, 80ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32 STMicroelectronics M27C801-100F6 vs M27C801-80B6
MX27C8000DC-10 UVPROM, 1MX8, 100ns, CMOS, CDIP32, CERAMIC, DIP-32 Macronix International Co Ltd M27C801-100F6 vs MX27C8000DC-10

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