Memory
M5M27C256AK-12
Mitsubishi Electric
Description: UVPROM, 32KX8, 120ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, GLASS SEALED, CERDIP-28

Overview of M5M27C256AK-12 by Mitsubishi Electric

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Where used in Applications: Consumer Electronics Industrial Automation Aerospace and Defense

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Part Data Attributes for M5M27C256AK-12 by Mitsubishi Electric

M5M27C256AK-12
Mitsubishi Electric
-
-
Pbfree Code
No
Rohs Code
No
Part Life Cycle Code
Obsolete
Ihs Manufacturer
MITSUBISHI ELECTRIC CORP
Part Package Code
DIP
Package Description
WDIP, DIP28,.6
Pin Count
28
Reach Compliance Code
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.61
Access Time-Max
120 ns
I/O Type
COMMON
JESD-30 Code
R-GDIP-T28
JESD-609 Code
e0
Length
36.7 mm
Memory Density
262144 bit
Memory IC Type
UVPROM
Memory Width
8
Number of Functions
1
Number of Terminals
28
Number of Words
32768 words
Number of Words Code
32000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
32KX8
Output Characteristics
3-STATE
Package Body Material
CERAMIC, GLASS-SEALED
Package Code
WDIP
Package Equivalence Code
DIP28,.6
Package Shape
RECTANGULAR
Package Style
IN-LINE, WINDOW
Parallel/Serial
PARALLEL
Programming Voltage
12.5 V
Qualification Status
Not Qualified
Seated Height-Max
5.1 mm
Standby Current-Max
0.0001 A
Supply Current-Max
0.03 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Width
15.24 mm
Want to compare parts?
  1. M5M27C256AK-12
    Mitsubishi Electric
    UVPROM, 32KX8, 120ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, GLASS SEALED, CERDIP-28
    VS

Alternate Parts for M5M27C256AK-12

This table gives cross-reference parts and alternative options found for M5M27C256AK-12. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M5M27C256AK-12, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
CY27C256A-120WC UVPROM, 32KX8, 120ns, CMOS, CDIP28, 0.600 INCH, HERMETIC SEALED, WINDOWED, CERDIP-28 Cypress Semiconductor M5M27C256AK-12 vs CY27C256A-120WC
AT27HC256R-12DC UVPROM, 32KX8, 120ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 Atmel Corporation M5M27C256AK-12 vs AT27HC256R-12DC
TC57256AD-12 IC 32K X 8 UVPROM, 120 ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28, Programmable ROM Toshiba America Electronic Components M5M27C256AK-12 vs TC57256AD-12
M27C256B-12F6 32KX8 UVPROM, 120ns, CDIP28, 0.280 INCH, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-28 STMicroelectronics M5M27C256AK-12 vs M27C256B-12F6
FT27C256R-12DC UVPROM, 32KX8, 12ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 Force Technologies Ltd M5M27C256AK-12 vs FT27C256R-12DC
M27C256B-12F1 32KX8 UVPROM, 120ns, CDIP28, 0.280 INCH, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-28 STMicroelectronics M5M27C256AK-12 vs M27C256B-12F1
M27C256B-12F6E 32KX8 UVPROM, 120ns, CDIP28, 0.280 INCH, ROHS COMPLIANT, CERAMIC, WINDOWED, FRIT SEALED, DIP-28 STMicroelectronics M5M27C256AK-12 vs M27C256B-12F6E
AS27C256-12JM UVPROM, 32KX8, 120ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 Micross Components M5M27C256AK-12 vs AS27C256-12JM
AM27C256-120/BXA UVPROM, 32KX8, 120ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD M5M27C256AK-12 vs AM27C256-120/BXA
NM27C256QE120 IC 32K X 8 UVPROM, 120 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM Texas Instruments M5M27C256AK-12 vs NM27C256QE120
Part Number Description Manufacturer Compare
M27C256B-12F6 32KX8 UVPROM, 120ns, CDIP28, 0.280 INCH, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-28 STMicroelectronics M5M27C256AK-12 vs M27C256B-12F6
CY27C256A-120WMB UVPROM, 32KX8, 120ns, CMOS, CDIP28, 0.600 INCH, HERMETIC SEALED, WINDOWED, CERDIP-28 Cypress Semiconductor M5M27C256AK-12 vs CY27C256A-120WMB
M27C256B-12F7X 32KX8 UVPROM, 120ns, CDIP28, FRIT SEALED, WINDOWED, CERAMIC, DIP-28 STMicroelectronics M5M27C256AK-12 vs M27C256B-12F7X
AS27C256-12JXT UVPROM, 32KX8, 120ns, CMOS, CDIP28, 0.600 INCH, CERAMIC, DIP-28 Micross Components M5M27C256AK-12 vs AS27C256-12JXT
TMS27C256-12JE4 32KX8 UVPROM, 120ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 Texas Instruments M5M27C256AK-12 vs TMS27C256-12JE4
AT27HC256R-12DC UVPROM, 32KX8, 120ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 Atmel Corporation M5M27C256AK-12 vs AT27HC256R-12DC
M27C256B-12F1L 32KX8 UVPROM, 120ns, CDIP28, WINDOWED, FRIT SEALED, CERAMIC, DIP-28 STMicroelectronics M5M27C256AK-12 vs M27C256B-12F1L
AT27LV256R-12DI UVPROM, 32KX8, 120ns, CMOS, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 Atmel Corporation M5M27C256AK-12 vs AT27LV256R-12DI
M27C256B-12XF7X 32KX8 UVPROM, 120ns, CDIP28, FRIT SEALED, WINDOWED, CERAMIC, DIP-28 STMicroelectronics M5M27C256AK-12 vs M27C256B-12XF7X
AM27C256-125DC UVPROM, 32KX8, 120ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD M5M27C256AK-12 vs AM27C256-125DC

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