Part Details for MAX32590-L5S+ by Analog Devices Inc
Overview of MAX32590-L5S+ by Analog Devices Inc
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for MAX32590-L5S+
Part # | Distributor | Description | Stock | Price | Buy | |
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Analog Devices Inc | DEEP COVER HIGH PERFORMANCE SE Min Qty: 1 Package Multiple: 1 | 0 |
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Part Details for MAX32590-L5S+
MAX32590-L5S+ CAD Models
MAX32590-L5S+ Part Data Attributes:
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MAX32590-L5S+
Analog Devices Inc
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MAX32590-L5S+
Analog Devices Inc
DeepCover Secure Microcontroller with ARM926EJ-S Processor Core, 324-CSP_BGA-15X15X0.96, 324 Pins, -40 to 85C
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | ANALOG DEVICES INC | |
Part Package Code | 324-CSP_BGA-15X15X0.96 | |
Package Description | CSBGA-324 | |
Pin Count | 324 | |
Manufacturer Package Code | 324-CSP_BGA-15X15X0.96 | |
Reach Compliance Code | compliant | |
Date Of Intro | 2012-11-14 | |
Samacsys Manufacturer | Analog Devices | |
Has ADC | YES | |
Address Bus Width | ||
Bit Size | 32 | |
Boundary Scan | NO | |
CPU Family | ARM926EJ-S92 | |
DAC Channels | NO | |
DMA Channels | YES | |
External Data Bus Width | ||
Format | FIXED POINT | |
Integrated Cache | YES | |
JESD-30 Code | S-PBGA-B324 | |
JESD-609 Code | e1 | |
Length | 15 mm | |
Low Power Mode | YES | |
Moisture Sensitivity Level | 3 | |
Number of DMA Channels | 16 | |
Number of I/O Lines | 160 | |
Number of Terminals | 324 | |
Number of Timers | 3 | |
On Chip Data RAM Width | 8 | |
PWM Channels | YES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFBGA | |
Package Equivalence Code | BGA324,18X18,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
RAM (bytes) | 393216 | |
Seated Height-Max | 1.4 mm | |
Speed | 384 MHz | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 15 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |