Datasheets
MAX32625IWY+ by:

RISC Microcontroller, CMOS,

Part Details for MAX32625IWY+ by Maxim Integrated Products

Overview of MAX32625IWY+ by Maxim Integrated Products

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Applications Internet of Things (IoT) Environmental Monitoring Financial Technology (Fintech) Smart Cities Energy and Power Systems Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Consumer Electronics Audio and Video Systems Computing and Data Storage Healthcare Renewable Energy Communication and Networking Robotics and Drones

Price & Stock for MAX32625IWY+

Part # Distributor Description Stock Price Buy
DISTI # 99Y9417
Newark Mcu, 32Bit, Cortex-M4F, 96Mhz, Wlp-100, Product Range:Max Family Max326Xx Series Microcontrollers, Architecture:Arm Cortex-M4F, No. Of Bits:32Bit, Cpu Speed:96Mhz, Program Memory Size:512Kb, Ram Memory Size:160Kb, No. Of Pins:63Pins, rohs Compliant: Yes |Maxim Integrated/analog Devices MAX32625IWY+ Min Qty: 1 Package Multiple: 1 Date Code: 1 Container: Bulk 0
  • 1 $7.2700
$7.2700 Buy Now
DISTI # MAX32625IWY+-ND
DigiKey IC MCU 32BIT 512KB FLASH 63WLP Lead time: 97 Weeks Container: Strip Temporarily Out of Stock
Buy Now

Part Details for MAX32625IWY+

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MAX32625IWY+ Part Data Attributes:

MAX32625IWY+ Maxim Integrated Products
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MAX32625IWY+ Maxim Integrated Products RISC Microcontroller, CMOS,
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer MAXIM INTEGRATED PRODUCTS INC
Package Description VFBGA,
Reach Compliance Code compliant
HTS Code 8542.31.00.01
Date Of Intro 2016-10-28
Has ADC YES
Additional Feature ALSO REQUIRES 1.8V NOM SUPPLY, SEATED HGT-CALCULATED
Address Bus Width
Bit Size 32
Clock Frequency-Max 0.032 MHz
DAC Channels NO
DMA Channels YES
External Data Bus Width
JESD-30 Code R-PBGA-B63
JESD-609 Code e2
Length 3.868 mm
Moisture Sensitivity Level 1
Number of I/O Lines 40
Number of Terminals 63
On Chip Program ROM Width 8
Operating Temperature-Max 85 °C
Operating Temperature-Min -30 °C
PWM Channels YES
Package Body Material PLASTIC/EPOXY
Package Code VFBGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
RAM (bytes) 163840
ROM (words) 524288
ROM Programmability FLASH
Seated Height-Max 0.69 mm
Speed 96 MHz
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
Supply Voltage-Nom 1.2 V
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Finish TIN SILVER COPPER NICKEL
Terminal Form BALL
Terminal Pitch 0.4 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 3.068 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC

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