Part Details for MAX32625IWY+ by Maxim Integrated Products
Overview of MAX32625IWY+ by Maxim Integrated Products
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Energy and Power Systems
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Consumer Electronics
Audio and Video Systems
Computing and Data Storage
Healthcare
Renewable Energy
Communication and Networking
Robotics and Drones
Price & Stock for MAX32625IWY+
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
99Y9417
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Newark | Mcu, 32Bit, Cortex-M4F, 96Mhz, Wlp-100, Product Range:Max Family Max326Xx Series Microcontrollers, Architecture:Arm Cortex-M4F, No. Of Bits:32Bit, Cpu Speed:96Mhz, Program Memory Size:512Kb, Ram Memory Size:160Kb, No. Of Pins:63Pins, rohs Compliant: Yes |Maxim Integrated/analog Devices MAX32625IWY+ Min Qty: 1 Package Multiple: 1 Date Code: 1 Container: Bulk | 0 |
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$7.2700 | Buy Now |
DISTI #
MAX32625IWY+-ND
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DigiKey | IC MCU 32BIT 512KB FLASH 63WLP Lead time: 97 Weeks Container: Strip | Temporarily Out of Stock |
|
Buy Now |
Part Details for MAX32625IWY+
MAX32625IWY+ CAD Models
MAX32625IWY+ Part Data Attributes:
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MAX32625IWY+
Maxim Integrated Products
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Datasheet
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MAX32625IWY+
Maxim Integrated Products
RISC Microcontroller, CMOS,
|
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | MAXIM INTEGRATED PRODUCTS INC | |
Package Description | VFBGA, | |
Reach Compliance Code | compliant | |
HTS Code | 8542.31.00.01 | |
Date Of Intro | 2016-10-28 | |
Has ADC | YES | |
Additional Feature | ALSO REQUIRES 1.8V NOM SUPPLY, SEATED HGT-CALCULATED | |
Address Bus Width | ||
Bit Size | 32 | |
Clock Frequency-Max | 0.032 MHz | |
DAC Channels | NO | |
DMA Channels | YES | |
External Data Bus Width | ||
JESD-30 Code | R-PBGA-B63 | |
JESD-609 Code | e2 | |
Length | 3.868 mm | |
Moisture Sensitivity Level | 1 | |
Number of I/O Lines | 40 | |
Number of Terminals | 63 | |
On Chip Program ROM Width | 8 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -30 °C | |
PWM Channels | YES | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | VFBGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
RAM (bytes) | 163840 | |
ROM (words) | 524288 | |
ROM Programmability | FLASH | |
Seated Height-Max | 0.69 mm | |
Speed | 96 MHz | |
Supply Voltage-Max | 1.26 V | |
Supply Voltage-Min | 1.14 V | |
Supply Voltage-Nom | 1.2 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Finish | TIN SILVER COPPER NICKEL | |
Terminal Form | BALL | |
Terminal Pitch | 0.4 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 3.068 mm | |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |