Part Details for MAX7358EUG+ by Analog Devices Inc
Overview of MAX7358EUG+ by Analog Devices Inc
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Education and Research
Internet of Things (IoT)
Industrial Automation
Computing and Data Storage
Aerospace and Defense
Healthcare
Renewable Energy
Telecommunications
Automotive
Robotics and Drones
Price & Stock for MAX7358EUG+
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
700-MAX7358EUG
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Mouser Electronics | Multiplexer Switch ICs 1-to-8 I C Bus Switches/Multiplexers with Bus Lock-up Detection, Isolation, and Notification RoHS: Compliant | 333 |
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$3.7300 / $6.5900 | Buy Now |
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Analog Devices Inc | 1-to-8 I²C Bus Switches/Multip Min Qty: 1 Package Multiple: 1 | 4345 |
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$3.3000 / $6.5900 | Buy Now |
Part Details for MAX7358EUG+
MAX7358EUG+ CAD Models
MAX7358EUG+ Part Data Attributes
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MAX7358EUG+
Analog Devices Inc
Buy Now
Datasheet
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MAX7358EUG+
Analog Devices Inc
1-to-8 I<sup>2</sup>C Bus Switches/Multiplexers with Bus Lock-up Detection, Isolation, and Notification, 24-TSSOP_4.4-4.4_MM, 24 Pins, -40 to 85C
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ANALOG DEVICES INC | |
| Part Package Code | 24-TSSOP_4.4-4.4_MM | |
| Package Description | ROHS COMPLIANT, TSSOP-24 | |
| Pin Count | 24 | |
| Manufacturer Package Code | 24-TSSOP_4.4-4.4_MM | |
| Reach Compliance Code | compliant | |
| Date Of Intro | 2008-09-25 | |
| Samacsys Manufacturer | Analog Devices | |
| Analog IC - Other Type | SINGLE-ENDED MULTIPLEXER | |
| JESD-30 Code | R-PDSO-G24 | |
| JESD-609 Code | e3 | |
| Length | 7.8 mm | |
| Moisture Sensitivity Level | 1 | |
| Number of Channels | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 24 | |
| On-state Resistance-Max (Ron) | 55 Ω | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TSSOP | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.1 mm | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.3 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 4.4 mm |