Part Details for MB81C71A-25P by FUJITSU Limited
Overview of MB81C71A-25P by FUJITSU Limited
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
10046971-019LF | Amphenol Communications Solutions | Power Card Edge, Power Connectors, 2 x 25P STB Vertical. | |
10046971-050LF | Amphenol Communications Solutions | Power Card Edge, Power Connectors, 2 x 25P STB Vertical. | |
D25S13A4PX00LF | Amphenol Communications Solutions | D25S13A4PX00LF-DSUB R/A STB 25P SOCKET |
Price & Stock for MB81C71A-25P
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
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Bristol Electronics | 1 |
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RFQ |
Part Details for MB81C71A-25P
MB81C71A-25P CAD Models
MB81C71A-25P Part Data Attributes
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MB81C71A-25P
FUJITSU Limited
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Datasheet
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MB81C71A-25P
FUJITSU Limited
Standard SRAM, 64KX1, 25ns, CMOS, PDIP22
|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | FUJITSU LTD | |
Part Package Code | DIP | |
Package Description | DIP, DIP22,.3 | |
Pin Count | 22 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 25 ns | |
I/O Type | SEPARATE | |
JESD-30 Code | R-PDIP-T22 | |
JESD-609 Code | e0 | |
Memory Density | 65536 bit | |
Memory IC Type | STANDARD SRAM | |
Memory Width | 1 | |
Number of Terminals | 22 | |
Number of Words | 65536 words | |
Number of Words Code | 64000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 64KX1 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | DIP | |
Package Equivalence Code | DIP22,.3 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Standby Current-Max | 0.01 A | |
Standby Voltage-Min | 4.5 V | |
Supply Current-Max | 0.08 mA | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL |