Part Details for MB89R112B1QN-G-AMERE1 by FUJITSU Limited
Overview of MB89R112B1QN-G-AMERE1 by FUJITSU Limited
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Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Part Details for MB89R112B1QN-G-AMERE1
MB89R112B1QN-G-AMERE1 CAD Models
MB89R112B1QN-G-AMERE1 Part Data Attributes
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MB89R112B1QN-G-AMERE1
FUJITSU Limited
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Datasheet
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MB89R112B1QN-G-AMERE1
FUJITSU Limited
Memory Circuit, 9KX8, CMOS, PQCC24, QFN-24
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | FUJITSU LTD | |
Package Description | HVQCCN, | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.71 | |
Additional Feature | DATA RETENTION TIME @ 85 DEGREE CENTIGRADE | |
Clock Frequency-Max (fCLK) | 2 MHz | |
Data Retention Time-Min | 10 | |
Endurance | 1000000000000 Write/Erase Cycles | |
JESD-30 Code | S-PQCC-N24 | |
Length | 4 mm | |
Memory Density | 73728 bit | |
Memory IC Type | FRAM-EMBEDDED | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 24 | |
Number of Words | 9216 words | |
Number of Words Code | 9000 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -20 °C | |
Organization | 9KX8 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | HVQCCN | |
Package Equivalence Code | LCC24,.2SQ,20 | |
Package Shape | SQUARE | |
Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
Parallel/Serial | SERIAL | |
Seated Height-Max | 0.75 mm | |
Serial Bus Type | SPI | |
Standby Current-Max | 0.000048 A | |
Standby Voltage-Min | 3 V | |
Supply Current-Max | 0.0005 mA | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 3 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Form | NO LEAD | |
Terminal Pitch | 0.5 mm | |
Terminal Position | QUAD | |
Width | 4 mm |