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Overview of MBRS1035HMNG by Taiwan Semiconductor
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- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for MBRS1035HMNG by Taiwan Semiconductor
Part Data Attributes for MBRS1035HMNG by Taiwan Semiconductor
|
|
---|---|
Part Life Cycle Code
|
Obsolete
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Ihs Manufacturer
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TAIWAN SEMICONDUCTOR CO LTD
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Package Description
|
D2PAK-3/2
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Reach Compliance Code
|
compliant
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ECCN Code
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EAR99
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HTS Code
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8541.10.00.80
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Additional Feature
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LOW POWER LOSS
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Application
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EFFICIENCY
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Case Connection
|
CATHODE
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Configuration
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SINGLE
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Diode Element Material
|
SILICON
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Diode Type
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RECTIFIER DIODE
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Forward Voltage-Max (VF)
|
0.84 V
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JEDEC-95 Code
|
TO-263AB
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JESD-30 Code
|
R-PSSO-G2
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JESD-609 Code
|
e3
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Moisture Sensitivity Level
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1
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Non-rep Pk Forward Current-Max
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120 A
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Number of Elements
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1
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Number of Phases
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1
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Number of Terminals
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2
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Operating Temperature-Max
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175 °C
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Operating Temperature-Min
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-55 °C
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Output Current-Max
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10 A
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Package Body Material
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PLASTIC/EPOXY
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Package Shape
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RECTANGULAR
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Package Style
|
SMALL OUTLINE
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Peak Reflow Temperature (Cel)
|
260
|
Reference Standard
|
AEC-Q101
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Rep Pk Reverse Voltage-Max
|
35 V
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Reverse Current-Max
|
100 µA
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Surface Mount
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YES
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Technology
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SCHOTTKY
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Terminal Finish
|
MATTE TIN
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Terminal Form
|
GULL WING
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Terminal Position
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SINGLE
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Time@Peak Reflow Temperature-Max (s)
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30
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